2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel
Rtv Silicone Two Component Thermal Conductive Adhesive Waterproof Low Viscosity Waterproof Sealing High Moisture Resistance Glue
HN-8806 Two-Component Addition-Type Silicone Potting Rubber
Product Specification
| Test Items | Test Standard | Units | Product test results | |||
| Part A | Part B | |||||
| Before curing | 1 | Appearance | --- | --- | Grey, fluid | White, fluid |
| 2 | Viscosity | GB/T10247-2008 | 25ºC, mPa·S | 4500~5000 | 4500~5000 | |
| 3 | Density | GB/T 13354-92 | 25ºC, g/cm³ | 1.50±0.05 | 1.50±0.05 | |
| 4 | Mixing Ratio (A : B) | 1:01 | Weight ratio | 100 | 100 | |
| Volume ratio | 100 | 100 | ||||
| 5 | Operating time | Measured | hr | 0.3-0.4 | ||
| 6 | Curing condition | Measured | hr | 4^12 (25ºC,initial cure) | ||
| 0.20 (80ºC) | ||||||
| After Curing |
7 | Appearance | --- | --- | Grey elastomer | |
| 8 | Hardness | GB/T 531.1-2008 | Shore A | 50±5 | ||
| 9 | Thermal conductivity | GB/T10297-1998 | w/m·k | ≥0.76 | ||
| 10 | Expansivity | GB/T20673-2006 | μm/(m,ºC) | 210 | ||
| 11 | Moisture Absorption | GB/T 8810-2005 | 24h,25ºC, % | 0.01~0.02 | ||
| 12 | Volume resistivity | GB/T 1692-92 | (DC500V),Ω · cm | 1.0×10¹⁵ | ||
| 13 | Dielectric intensity | GB/T 1693-2007 | Kv/mm(25ºC) | 18^25 | ||
| 14 | Temperature Resistance | Measured | ºC | -50~+250°c | ||
Product Advantages
High-Performance Elastomer: Forms a high-elasticity, high-strength protective layer after curing.
Low Viscosity: Suitable for deep-section potting, ensuring even distribution.
No By-Products: No heat or by-products are emitted during curing, ensuring component safety.
Flame Retardant: Passes UL-94 flame retardancy tests, ensuring safety in high-temperature environments.
Eco-Friendly Certification: Complies with RoHS standards, non-polluting.
Applications
Potting and sealing of power modules, circuit boards, and high-voltage transformers.
Protection and thermal management for battery packs and fast-charging adapters.
Moisture-proof and waterproof protection for LED outdoor drive power supplies.
Other electronic components requiring vibration, water, and thermal protection.
Application Method
1.Mix components A and B in a 1:1 ratio, stir thoroughly, and then proceed with potting.
2.Ensure the surface of the components is clean before potting. For large products, pot in stages.
3.For automated production lines, vacuum components A and B separately to ensure accurate mixing ratio.
Technical Parameters
Appearance: Part A – Grey fluid; Part B – White fluid
Viscosity: 4500~5000 mPa·S
Density: 1.50±0.05 g/cm³
Mixing Ratio (A:B): 1:1
Pot Life: 0.3-0.4 hours
Curing Conditions: 4-12 hours at room temperature (initial cure), 0.2 hours at 80°C
Hardness: 50±5 Shore A
Thermal Conductivity: ≥0.76 W/m·K
Volume Resistivity: 1.0×10¹⁵ Ω·cm
Temperature Resistance: -50°C to +250°C
Packaging
10KG/Set (A 5kg + B 5kg)
20KG/Set (A 10kg + B 10kg)
50KG/Set (A 25kg + B 25kg)
Precautions
Stir components A and B separately before use to ensure even mixing.
Avoid contact with substances containing tin, sulfur, or amines to prevent curing inhibition.
Maintain cleanliness during use to prevent contamination.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.



