JSHESOL THERMAL INSULATION TECHNOLOGY CO., LTD
                                                                                                           
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High Density PIR Underfloor Heating Insulation Board Floor Insulation System Solution

Price Negotiable
Price: Negotiable
MOQ: 20 Cubic Meters
Delivery Time: Negotiable
Brand: JSHESOL
Product Description
High-Density PIR Underfloor Heating Insulation Board - Professional Grade Floor Insulation System Solution
Product Overview

The High-Density PIR Underfloor Heating Insulation Board is a high-performance substrate specifically developed for modern underfloor heating systems. Utilizing premium Polyisocyanurate (PIR) as the core material, it is manufactured through precision processes into reinforced panels with a density of ≥45kg/m³. It combines exceptional compressive strength with long-lasting thermal insulation performance.

Its unique closed-cell structure not only effectively blocks heat loss to the subfloor, enhancing the thermal efficiency of the heating system, but also provides a solid and level base for the floor finishing, preventing deformation or cracking under long-term load.

 
Core Advantages
  • Exceptional Load-Bearing Capacity
    With a high-density structure (≥45kg/m³) and compressive strength (≥300 kPa), it reliably supports the combined load from heating pipes, concrete screed, and floor finishes, ensuring long-term stability without deformation.
  • High Energy Efficiency, Minimal Heat Loss
    The ultra-low thermal conductivity (≤0.023 W/(m*K)) effectively blocks downward heat transfer, concentrating thermal energy within the heated space, significantly improving warm-up times and reducing energy consumption.
  • Superior Moisture & Dimensional Stability
    High closed-cell content (≥95%) effectively resists moisture ingress, preventing performance degradation due to dampness. Maintains dimensional stability under temperature fluctuations, avoiding floor loosening from expansion/contraction.
  • Environmentally Safe & Easy Installation
    Complies with indoor building material environmental standards, odor-free. Lightweight panels are easy to cut, and tongue-and-groove or butt joint designs enable efficient installation, speeding up construction progress.
 
Key Performance Parameters
Item Unit Technical Data Test Standard
Density kg/m³ ≥45 ASTM D1622
Compressive Strength (at 10% deformation) kPa ≥300 ASTM D1621
Thermal Conductivity (25℃) W/(m*K) ≤0.023 ASTM C177
Closed Cell Content % ≥95 ASTM D6226
Dimensional Stability (70℃ ±2℃,48h) % ≤1.5 ASTM D2126
Fire Classification - B1 GB 8624
Water Absorption (by volume) % ≤1.5 ASTM D2842
 
Typical Applications
  • Insulation base layer for wet/dry underfloor heating systems in residential and commercial buildings.
  • Raised floor insulation requiring high standards of flatness and load-bearing capacity.
  • Applications with moisture concerns in low-temperature radiant heating systems (e.g., ground floors, basements).
  • Green building projects with high requirements for energy efficiency and living comfort.
 
Why Choose This Product
  • Professional UFH Solution
    Our product formulation and structure are optimized for the specific needs of underfloor heating, providing a complete solution from substrate insulation to load-bearing support.
  • Durability for System Longevity
    High density and compressive strength ensure the stability of the floor system over the long term, avoiding repair costs due to base layer failure.
  • Comprehensive Heating Efficiency
    Excellent insulation properties can help reduce UFH system energy consumption by up to 30%, shorten pre-heating time, and deliver a more comfortable and economical heating experience.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company JSHESOL THERMAL INSULATION TECHNOLOGY CO., LTD
Location Room 601, Building 3, Leading Tower, High-speed Railway New Town, No. 3 Xiushuihe Road, Xinqiao Sub-district, Xinbei District, Changzhou City, Jiangsu Province, China
Contact Person hua

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