High Density PIR Underfloor Heating Insulation Board Floor Insulation System Solution
The High-Density PIR Underfloor Heating Insulation Board is a high-performance substrate specifically developed for modern underfloor heating systems. Utilizing premium Polyisocyanurate (PIR) as the core material, it is manufactured through precision processes into reinforced panels with a density of ≥45kg/m³. It combines exceptional compressive strength with long-lasting thermal insulation performance.
Its unique closed-cell structure not only effectively blocks heat loss to the subfloor, enhancing the thermal efficiency of the heating system, but also provides a solid and level base for the floor finishing, preventing deformation or cracking under long-term load.
- Exceptional Load-Bearing Capacity
With a high-density structure (≥45kg/m³) and compressive strength (≥300 kPa), it reliably supports the combined load from heating pipes, concrete screed, and floor finishes, ensuring long-term stability without deformation. - High Energy Efficiency, Minimal Heat Loss
The ultra-low thermal conductivity (≤0.023 W/(m*K)) effectively blocks downward heat transfer, concentrating thermal energy within the heated space, significantly improving warm-up times and reducing energy consumption. - Superior Moisture & Dimensional Stability
High closed-cell content (≥95%) effectively resists moisture ingress, preventing performance degradation due to dampness. Maintains dimensional stability under temperature fluctuations, avoiding floor loosening from expansion/contraction. - Environmentally Safe & Easy Installation
Complies with indoor building material environmental standards, odor-free. Lightweight panels are easy to cut, and tongue-and-groove or butt joint designs enable efficient installation, speeding up construction progress.
| Item | Unit | Technical Data | Test Standard |
|---|---|---|---|
| Density | kg/m³ | ≥45 | ASTM D1622 |
| Compressive Strength (at 10% deformation) | kPa | ≥300 | ASTM D1621 |
| Thermal Conductivity (25℃) | W/(m*K) | ≤0.023 | ASTM C177 |
| Closed Cell Content | % | ≥95 | ASTM D6226 |
| Dimensional Stability (70℃ ±2℃,48h) | % | ≤1.5 | ASTM D2126 |
| Fire Classification | - | B1 | GB 8624 |
| Water Absorption (by volume) | % | ≤1.5 | ASTM D2842 |
- Insulation base layer for wet/dry underfloor heating systems in residential and commercial buildings.
- Raised floor insulation requiring high standards of flatness and load-bearing capacity.
- Applications with moisture concerns in low-temperature radiant heating systems (e.g., ground floors, basements).
- Green building projects with high requirements for energy efficiency and living comfort.
- Professional UFH Solution
Our product formulation and structure are optimized for the specific needs of underfloor heating, providing a complete solution from substrate insulation to load-bearing support. - Durability for System Longevity
High density and compressive strength ensure the stability of the floor system over the long term, avoiding repair costs due to base layer failure. - Comprehensive Heating Efficiency
Excellent insulation properties can help reduce UFH system energy consumption by up to 30%, shorten pre-heating time, and deliver a more comfortable and economical heating experience.
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