100μM 3D X Ray Inspection System For PCBA And Semiconductor Analysis
Price:
Negotiable
MOQ:
1
Delivery Time:
Negotiable
Brand:
WELLMAN
Product Description
3D X-ray Inspection System
Detection Applications
- Large size PCBA board inspection
- Internal structural quality analysis of semiconductor packaging
- SMT welding quality assessment including:
- Open welding detection
- Infiltration analysis
- Solder amount measurement
- Offset detection
- Foreign body identification
- Bridge and pin inspection
Equipment Characteristics
- 2D/2.5D imaging with multi-axis linkage for ROI imaging
- Advanced imaging enhancement capabilities
- Automatic analysis and image analysis functions
- Scanning programming functionality
- Optional rotating disk imaging module for multi-angle observation
- 3D imaging for local devices on complete boards
- Turntable and cone-beam CT imaging options for small devices
Technical Specifications
| X-ray Source | |
|---|---|
| X-ray Tube Type | Closed-tube X-ray source |
| Tube voltage range | 20-160 KV |
| Detector Parameters | |
| Detector type | Amorphous silicon fat panel detector |
| Pixel size | 100 μm |
| Pixel matrix | 1536*1536 |
| Maximum possible sample size | Flat test bench 580*530mm Rotating test stand 300*300mm Rollover test stand 250*300mm |
| Maximum imaging area | Flat test bench 460*410mm Rotating test stand 300*300mm Rollover test stand 250*100mm |
| JIMA card resolution | Standard 0.9μm, max 0.5μm |
| Equipment weight | 4T |
| Equipment size | 1800 mm*1800 mm*2300 mm (Length * width * height) |
| Imaging software system | Integrated scanning imaging software 3D image reconstruction software 3D image measurement and analysis software Image database management software |
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
SHENZHEN WEIMING PHOTOELECTRIC CO.,LTD.
Location
5F,B3, Anda ElectronicsIndustrial Factory, HepingCommunity, Fuhai Street, BaoanDistrict, Shenzhen
Contact Person
Jeff Chan