Speed Adjustable Electronics X Ray System Inspects BGA Voids PCB Through Holes
WELLMAN X-Ray System X6000 Inspects BGA Voids, PCB Through-Holes – 1500X Magnification & Maintenance-Free Tube
- Sealed X-ray tube with over 10,000 hours of operational life (maintenance-free)
- Auto-navigation window – table moves to the clicked position
- Optional 360° rotating jig for multi-angle inspection
- Intuitive operation requiring only 2 hours training
- Speed adjustable 3-axis linkage system
- New-generation 5-inch high-definition digital flat panel detector (FPD)
- 420×420mm work table with 15KG load capacity
- Programmable inspection processes for automated batch inspection
| Type | Closed, microfocus |
| Max tube voltage | 90kV |
| Max tube current | 200μA |
| Focal spot size | 5μm |
| Function | Auto preheat |
| Effective area | 130mm×130mm |
| Pixel size | 85μm |
| Resolution | 1536×1536 |
| Frame rate | 20fps |
| Size | 420mm×420mm |
| Detectable area | 400mm×400mm |
| Max load | 15kg |
| Magnification | Geometry 150X | System 1500X |
| Inspection speed | Max 3.0s/point |
| Dimensions | 1100mm (L) × 1000mm (W) × 1600mm (H) |
| Weight | 1000kg |
| Power supply | AC110-220V 50/60HZ |
| Max power | 1300W |
| Industrial PC | Intel I5 CPU, 8G RAM, 240GB SSD |
| Displayer | 24" HDMI LCD |
| Radiation leakage | No leakage (≤1μSv/h, international standard) |
| Lead glass observation window | Transparent lead glass shields radiation while allowing internal observation |
| Window/door safety interlock | X-ray automatically powers off when window/door is opened |
| Electromagnetic safety switch | Locks observation window when X-ray is active |
| Emergency stop | Instant power-off button near operation position |
| Tube protection | Software prevents X-ray tube from being left on |
Full keyboard and mouse control for all functions, including X-ray tube activation and parameter adjustment.
Comprehensive measurement functions including distance, angle, radius, perimeter, and distance rate calculations for through-hole soldering analysis.
Three modes available: manual point setting, array pattern for regular points, and automatic feature recognition to enable efficient batch processing.
Adjustable brightness, contrast, and gain to achieve optimal image quality. Save and retrieve inspection parameters for repeated inspections.
Automatically calculates solder ball voids rate, area, and circumference, while identifying defects. Supports manual void marking and parameter saving for consistent results.
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