3D X Ray Inspection Machine For Solder Joint Defects 750mm Sample Size

Price Negotiable

Price: Negotiable

MOQ: 1

Delivery Time: Negotiable

Brand: WELLMAN

Product Description

3D X Ray Inspection for Solder Joint Defects - Fast and Accurate Analysis with Ultra-Inline CT/3D Equipment

Ultra-Inline CT/3D Equipment Features

Full 3D automatic imaging and analysis
Applicable for both on-line inspection and off-line analysis
Capable of achieving fast CT imaging, with the fastest local imaging time less than 3 seconds
Solves the problem of solder joint defect inspection that cannot be achieved by traditional 2D and 2.5D equipment
Can be connected to the user's database to directly import inspection results

Inspection Applications

Large-sized PCBA boards
The internal structure quality of semiconductor packaging products
The welding quality of various types of SMT solder joints, including open soldering, wetting conditions, solder volume, offset, foreign objects, bridging, and the presence of pins

Detector Parameters

Detector type	Amorphous silicon flat panel detector
Pixel size	49.8 μm
Pixel matrix	2304*2813
Effective imaging area	115 mm*140 mm
Picture frame rate	18 fps (1*1)

Equipment Performance Parameters

Maximum possible sample size	750 mm*530 mm (Length x Width)
Maximum imaging area	730 mm*510 mm (Length x Width)
JIMA card resolution	4μm
Equipment weight	5T
Equipment size	2336 mm2321 mm2109 mm (Length * width * height)
Imaging software system	A set of online plate CT imaging system, including integrated scanning, data analysis and other modules