Multifunctional Tiltable X-ray Inspection Equipment for LED/PCBA/BGA

Price Negotiable

Price: Negotiable

MOQ: 1

Delivery Time: 5-8 work days

Brand: WELLMAN

Product Description

Multifunctional Tiltable Inspection Equipment for LED/PCBA/BGA — X-6000

Advanced X-ray inspection system designed for comprehensive quality control of electronic components including LED, PCBA, and BGA assemblies.

Key Advantages

Closed type X-ray tube with over 10,000 hours lifetime, maintenance-free operation
New generation 5" HD digital flat panel detector (FPD)
Automatic navigation window - table moves to clicked positions
420*420mm table with 15KG load capacity
Speed adjustable 3-axis linkage system
Programmable inspection procedures for automated batch inspection
Optional 360° rotary jig for multi-angle inspection
User-friendly operation with minimal training requirement (2 hours)

Hardware Specifications

X-ray Source

Flat Panel Detector

Table Specifications

Equipment Parameters

Safety Features

Radiation Leakage	No leakage, international standard: ≤1μSv/h
Lead Glass Observation Window	Transparent lead glass window shields radiation to observe the inner status
Window and Back Door Safety Interlock	X-ray tube powers off immediately when window or back door is opened
Electromagnetic Safety Switch	Locks when X-ray is on, preventing window opening
Emergency Stop	Located next to operation position for immediate power cutoff
Tube Protection	Prevents software exit without proper X-ray tube closure

Software Capabilities

Core Functions

Function Module	Operation
X-ray Tube Control	Mouse-click activation with real-time voltage/current display and adjustment
Status Bar	Visual indication of interlock, pre-heat, and X-ray status
Image Effect Adjustment	Adjustable brightness, contrast and gain for optimal imaging
Product List	Save and recall inspection parameters for efficiency
Navigation Window	Click-to-move table positioning with camera guidance
Motion Axis Status	Real-time coordinate display
Inspection Result	Organized display of measurement data with pass/fail indicators
Speed Control	Adjustable movement speed for each axis (slow, normal, fast)

Voids Rate Measurement

Automatic Calculation	Rectangle-based solder ball analysis with void detection and NG/OK status
Parameters Adjustment	Customizable grayscale threshold, pixel, contrast, and size filtering
Add Voids Manually	Polygon or free-form void addition for comprehensive analysis
Save Parameters	Store and reuse measurement settings for consistent results

Additional Measurement Functions

Distance	Vertical distance measurement from point to baseline
Distance Rate	Percentage ratio calculation for through-hole soldering rate
Angle	Angle measurement between defined rays
Radius	Circle measurement for round components with circumference and area
Perimeter	Square component measurement with length, width and area

Automated Inspection Modes

Manual Setting	Custom inspection point positioning with automatic image capture
Array	Grid-based automatic inspection with row/column configuration
Automatic Identification	Feature-based position recognition with automated measurement

Working Principle