SHENZHEN WEIMING PHOTOELECTRIC CO.,LTD.
                                                                                                           
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8 Years
Since 2018
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Semiconductor X-ray Inspection Equipment with a 400*400mm Large Stage and 10kg Load Capacity

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Brand: WELLMAN
Product Description
X8800 Semiconductor Inspection Equipment
Advanced 3D/CT inspection system featuring a 400*400mm large stage with 10kg load capacity for comprehensive semiconductor analysis.
Key Advantages
  • Open type X-ray tube with unlimited service life (only filament replacement required)
  • New generation 5" HD digital flat panel detector (FPD)
  • FPD tilts 60° and rotates 360° for optimal positioning
  • Automatic navigation window - table moves to clicked positions
  • 400*400mm table with 10kg load capacity
  • Speed adjustable 5-axis linkage system
  • Optional ACT and PCT 3D CT functionality
  • Intuitive operation with minimal training required (approximately 2 hours)
Hardware Specifications
X-ray Source
TypeOpen, microfocus
Maximum Tube Voltage160kV
Maximum Tube Current500μA
Target Power15W
Tube Power65W
Focal Spot Size1μm
Flat Panel Detector
Effective Area130mm*130mm
Pixel Size49.5μm
Resolution1536*1536
Frame Rate20fps
Tiltable Angle60°
Rotation Angle360°
Table Specifications
Size400mm*400mm
Detectable Area400mm*400mm
Maximum Load10kg
Equipment Details
Geometry Magnification2500X
Inspection SpeedMaximum 3.0s/point
Dimensions1550mm (L) * 1600mm (W) * 1700mm (H)
Weight1800kg
Power SupplyAC110-220V 50/60HZ
Maximum Power1800W
Industrial PCI7 CPU, 16G RAM, 240GB SSD+1TB HDD
Display24" HDMI LCD
Safety Features
Radiation LeakageNo leakage, international standard: ≤1μSv/h
Lead Glass Observation WindowTransparent lead glass shields radiation for internal status observation
Window and Back Door Safety InterlockX-ray tube powers off immediately when opened; prevents X-ray activation when open
Electromagnetic Safety SwitchLocks when X-ray is active, preventing window opening
Emergency StopLocated near operation position for immediate power cutoff
Tube ProtectionPrevents software exit without closing X-ray tube
Working Principle
Diagram illustrating X8800 semiconductor inspection equipment working principle and component layout
Software Capabilities
Core Functions
Function ModuleOperation
X-ray Tube ControlMouse-click activation with real-time voltage/current display and adjustment
Status BarVisual indication of interlock, pre-heat, and X-ray status
Image Effect AdjustmentBrightness, contrast and gain controls for optimal imaging
Product ListSave and recall inspection parameters for efficiency
Navigation WindowClick-to-move table positioning with camera guidance
Motion Axis StatusReal-time coordinate display
Inspection ResultOrganized display of measurement data (voids rate, distance, area)
Speed ControlAdjustable movement speed for each axis (slow, normal, fast)
Voids Rate Measurement
FeatureDescription
Automatic CalculationRectangle-based solder ball analysis with automatic void detection and NG/OK indication
Parameters AdjustmentCustomizable grayscale threshold, pixel, contrast, and size filtering
Manual Void AdditionPolygon or free-form drawing for custom void calculation
Parameter SavingStore and recall detection parameters for consistent results
Additional Measurement Functions
FunctionApplication
DistanceVertical distance measurement from point to baseline
Distance RateThrough-hole soldering rate calculation via percentage ratio
AngleAngle measurement between defined rays
RadiusCircular component measurement (solder balls) for circumference, area, radius
PerimeterSquare component measurement for length, width, and area
Automated Inspection Modes
ModeDescription
Manual SettingCustom inspection point placement with automatic imaging
ArrayGrid-based automatic inspection from minimal setup parameters
Automatic IdentificationFeature-based position recognition with automated measurement and imaging
Application Examples
BGA solder bridge inspection example showing connection defects
BGA Solder Bridge
BGA solder voids analysis displaying internal cavity detection
BGA Solder Voids
PCB through-hole inspection showing solder fill quality
PCB Through-Hole
IC voids and gold wire inspection with internal structure visualization
IC Voids and Gold Wire
LED solder voids detection in semiconductor packaging
LED Solder Voids
LED gold wire crack analysis showing connection integrity
LED Gold Wire Crack
Capacitor internal structure inspection for quality assurance
Capacitor
Inductor component analysis showing internal winding integrity
Inductor
Sensor component inspection with detailed internal structure visualization
Sensor
Thyristor surge suppressors internal component analysis
Thyristor Surge Suppressors
Fiberglass material inspection showing internal structure and defects
Fiberglass
Cable internal structure analysis for quality control
Cable
Diode component inspection with internal junction analysis
Diode
Steel pipe welding gap measurement for structural integrity assessment
Steel Pipe Welding Gap
Automotive electronics inspection showing component quality and connections
Automotive Electronics

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company SHENZHEN WEIMING PHOTOELECTRIC CO.,LTD.
Location 5F,B3, Anda ElectronicsIndustrial Factory, HepingCommunity, Fuhai Street, BaoanDistrict, Shenzhen
Contact Person Jeff Chan

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