X-ray Inspection Equipment with a 400*400mm Large Stage and 10kg Load Capacity for Electronics
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Brand:
WELLMAN
Product Description
Electronic Components Inspection Equipment with 400×400mm Large Stage and 10kg Load Capacity
X8800 X-ray Inspection Equipment
Advanced 3D/CT inspection system featuring a 400×400mm large stage with 10kg load capacity for comprehensive electronic components analysis.
Key Advantages
- Open type X-ray tube with extended service life
- New generation 5" HD digital flat panel detector
- FPD tilts 60° and rotates 360° for optimal positioning
- Automatic navigation window - table moves to clicked positions
- 400×400mm table with 10kg load capacity
- Speed adjustable 5-axis linkage system
- Optional ACT and PCT 3D CT functionality
- Easy operation with minimal training required (2 hours)
Hardware Specifications
X-ray Source
| Type | Open, microfocus |
|---|---|
| Maximum Tube Voltage | 160kV |
| Maximum Tube Current | 500μA |
| Target Power | 15W |
| Tube Power | 65W |
| Focal Spot Size | 1μm |
Flat Panel Detector
| Tiltable Angle | 60° |
|---|---|
| Rotation Angle | 360° |
| Pixel Size | 49.5μm |
| Resolution | 1536×1536 |
| Frame Rate | 20fps |
Table Specifications
| Size | 400mm×400mm |
|---|---|
| Detectable Area | 400mm×400mm |
| Maximum Load | 10kg |
Equipment Details
| Geometry Magnification | 2500X |
|---|---|
| Inspection Speed | Maximum 3.0s/point |
| Dimensions | 1550mm (L) × 1600mm (W) × 1700mm (H) |
| Weight | 1800kg |
| Power Supply | AC110-220V 50/60HZ |
| Maximum Power | 1800W |
| Industrial PC | I7 CPU, 16G RAM, 240GB SSD+1TB HDD |
| Display | 24" HDMI LCD |
Safety Features
| Radiation Leakage | No leakage, international standard: ≤1μSv/h |
|---|---|
| Lead Glass Observation Window | Transparent lead glass shields radiation for internal status observation |
| Window and Back Door Safety Interlock | X-ray tube powers off immediately when opened; prevents X-ray activation when open |
| Electromagnetic Safety Switch | Locks when X-ray is active |
| Emergency Stop | Located near operation position for immediate power cutoff |
| Tube Protection | Prevents software exit without closing X-ray tube |
Working Principle
X8800 Semiconductor Inspection Equipment Working Principle
Software Capabilities
Core Functions
| Function Module | Operation |
|---|---|
| X-ray Tube Control | Mouse-click activation with real-time voltage/current display and adjustment |
| Status Bar | Visual indication of interlock, pre-heat, and X-ray status |
| Image Effect Adjustment | Brightness, contrast and gain controls for optimal imaging |
| Product List | Save and recall inspection parameters for efficiency |
| Navigation Window | Click-to-move table positioning with camera guidance |
| Motion Axis Status | Real-time coordinate display |
| Inspection Result | Organized display of measurement data (voids rate, distance, area) |
| Speed Control | Adjustable movement speed (slow, normal, fast) |
Voids Rate Measurement
| Feature | Description |
|---|---|
| Automatic Calculation | Rectangle-based solder ball analysis with automatic void detection and NG/OK indication |
| Parameters Adjustment | Customizable grayscale threshold, pixel, contrast, and size filtering |
| Manual Void Addition | Polygon or free-form drawing for custom void calculation |
| Parameter Saving | Store and recall detection parameters for consistent results |
Additional Measurement Functions
| Function | Application |
|---|---|
| Distance | Vertical distance measurement from point to baseline |
| Distance Rate | Through-hole soldering rate calculation via percentage ratio |
| Angle | Angle measurement between defined rays |
| Radius | Circular component measurement (solder balls) for circumference, area, radius |
| Perimeter | Square component measurement for length, width, and area |
Automated Inspection Modes
| Mode | Description |
|---|---|
| Manual Setting | Custom inspection point placement with automatic imaging |
| Array | Grid-based automatic inspection from minimal setup parameters |
| Automatic Identification | Feature-based position recognition with automated measurement and imaging |
Application Examples
BGA Solder Bridge
BGA Solder Voids
PCB Through-Hole
IC Voids and Gold Wire
LED Solder Voids
LED Gold Wire Crack
Capacitor
Inductor
Sensor
Thyristor Surge Suppressors
Fiberglass
Cable
Diode
Steel Pipe Welding Gap
Automotive Electronics
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
SHENZHEN WEIMING PHOTOELECTRIC CO.,LTD.
Location
5F,B3, Anda ElectronicsIndustrial Factory, HepingCommunity, Fuhai Street, BaoanDistrict, Shenzhen
Contact Person
Jeff Chan