Orient OR M0C3063L S TA1 photo triac optocoupler suitable for industrial automation and motor control
Product Overview
The OR-MOC304X(L)/306X(L)/308X(L) series from Shenzhen Orient Components Co., Ltd. are zero-voltage crossing photo triac optocouplers designed for interfacing logic systems with AC power control. Each device comprises a GaAs infrared emitting diode optically coupled to a monolithic silicon zero voltage crossing photo triac. They are ideal for applications requiring high isolation voltage, such as solid-state relays, industrial controls, motor control, solenoid operation, and consumer appliances.
Product Attributes
- Brand: ORIENT
- Manufacturer: Shenzhen Orient Components Co., Ltd.
- Certifications: UL approved (No.E323844), VDE approved (No.40029733), CQC approved (No.CQC19001231480)
- Compliance: RoHS, REACH standards
- MSL Level: 1
- Origin: Shenzhen, GD, China
Technical Specifications
| Feature/Model | OR-MOC304X(L) | OR-MOC306X(L) | OR-MOC308X(L) | Unit | Condition |
|---|---|---|---|---|---|
| Features | |||||
| High Isolation Voltage (Viso) | 5000 | V rms | |||
| High Repetitive Peak Off-State Voltage (VDRM) | Min. 400 | Min. 600 | Min. 800 | V | |
| High Critical Rate of Rise of Off-State Voltage (dV/dt) | MIN. 1000 | V /s | |||
| Operating Temperature | -40 to +110 | ||||
| Absolute Maximum Ratings | |||||
| Input Forward Current (IF) | 50 | mA | (Ta=25) | ||
| Input Junction Temperature (TJ) | 125 | (Ta=25) | |||
| Input Reverse Voltage (VR) | 6 | V | (Ta=25) | ||
| Input Power Dissipation (P) | 120 | mW | (Ta=25) | ||
| Off-State Output Terminal Voltage (VDRM) | 400 | 600 | 800 | V | (Ta=25) |
| Peak Repetitive Surge Current (ITSM) | 1 | A | (PW=1ms, 120 pps, Ta=25) | ||
| On-State RMS Current (IT(RMS)) | 100 | mA | (Ta=25) | ||
| Output Junction Temperature (TJ) | 125 | (Ta=25) | |||
| Collector Power Dissipation (PC) | 150 | mW | (Ta=25) | ||
| Total Power Dissipation (Ptot) | 250 | mW | (Ta=25) | ||
| Insulation Voltage (Viso) | 5000 | Vrms | (*1 AC for 1 minute, R.H.= 40 ~ 60%) | ||
| Working Temperature (Topr) | -40 ~ +110 | ||||
| Deposit Temperature (Tstg) | -55 ~ +125 | (*2 For 10 second) | |||
| Soldering Temperature (Tsol) | 260 | (*1) | |||
| Electrical Optical Characteristics | |||||
| Input Forward Voltage (VF) | 1.2 - 1.6 | V | IF=20mA, Ta=25C | ||
| Input Reverse Current (IR) | --- 5 | A | VR=6V, Ta=25C | ||
| Peak Blocking Current, Either Direction (IDRM) | --- 100 | --- 100 | --- 500 | nA | VDRM = Rated VDRM, Ta=25C |
| Peak On-State Voltage, Either Direction (VTM) | --- 3.0 | V | ITM=100mA, Ta=25C | ||
| Peak 2.Critical rate of Rise of Off-State Voltage (dv/dt) | 1000 | V/s | Vin=240Vrms, Ta=25C | ||
| 3.Led Trigger Current (IFT) | --- 30 | --- 15 | --- 10 | mA | Main Terminal Voltage = 3V, Ta=25C |
| Holding Current (IH) | --- 400 | A | Ta=25C | ||
| Inhibit Voltage (VINH) | --- 5 - 20 | Volts | IF =Rated IFT , Ta=25C | ||
| Leakage in Inhibited State (IDRM2) | --- 500 | A | IF = Rated IFT , Rated VDRM , Off State, Ta=25C | ||
Order Information
Part Number format: OR-MOC304X(L)V-W-Y, OR-MOC306X(L)V-W-Y, or OR-MOC308X(L)V-W-Y
Where X = 0, 1, 2, 3, or 4.
Lead Form Options:
- None: Standard DIP-6, 66 units per tube
- M: Wide lead bend (0.4 inch spacing), 66 units per tube
- S (TA): Surface mount lead form (low profile) + TA tape & reel, 1000 units per reel
- S (TA1): Surface mount lead form (low profile) + TA1 tape & reel, 1000 units per reel
VDE Option: 'V' code for VDE safety approval (Optional).
Package Dimensions & Footprint
Refer to diagrams for MOC30XX DIP, SOP, and Surface Mount package dimensions.
Recommended footprint patterns are provided for mounting.
Taping Dimensions & Packing
Taping Dimensions:
- TA Type: Tape Width (W) 160.3 mm, Sprocket Hole Pitch (P0) 40.1 mm, Compartment Distance (F) 7.50.1 mm, Compartment to Compartment Distance (P1) 120.1 mm.
- TA1 Type: Similar to TA type.
- Quantities per Reel: 1000 pcs.
Packing Information:
- Tube Packing: 66 pcs per tube.
- Reel Packing: 1000 pcs per reel.
Soldering Profile
IR Reflow Soldering (JEDEC-STD-020C compliant):
- Preheat: 150C to 200C, 9030 sec.
- Soldering Zone: TL 217C, tL 60 sec.
- Peak Temperature: 260C, 20 sec.
- Ramp-up rate: 3C/sec max.
- Ramp-down rate: 3~6C/sec.
- Reflow times: 3.
Wave Soldering (JEDEC22A111 compliant):
- Temperature: 260+0/-5C, 10 sec.
- Preheat temperature: 5 to 140C, 30 to 80 sec.
Hand Soldering:
- Temperature: 380+0/-5C, 3 sec max per lead.
Get in Touch
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