Solderable Terminals and Polarity Marking ChipNobo 1SMA5919BT3G-CN Zener Diode with High Reliability
Product Overview
This product features a molded plastic body and solder-plated, solderable terminals per MIL-STD-750, Method 2026. It is designed for general use in residential and commercial equipment, excluding sensitive items or specialized equipment in sanctioned areas. Key advantages include low leakage current, standard zener voltage tolerance of 5%, a voltage range of 5.6 volts, high peak reverse power dissipation, and high reliability. The device is suitable for any mounting position and has a weight of 0.0023 ounces (0.07 grams).
Product Attributes
- Case Material: Molded plastic body
- Terminal Plating: Solder plated
- Terminal Solderability: Solderable per MIL-STD-750, Method 2026
- Polarity Marking: Polarity symbol on body
- Mounting Position: Any
Technical Specifications
General Ratings at 25C Ambient Temperature (Unless Otherwise Specified)
| Rating | Symbol | Value | Unit |
|---|---|---|---|
| DC Power Dissipation at TL = 50C (Note 1) | PD | 2.0 | W |
| Maximum Forward Voltage at IF = 200 mA | VF | 1.2 | V |
| Junction Temperature Range | TJ | -55 to +150 | C |
| Storage Temperature Range | Ts | -55 to +150 | C |
Device Data
| Part Number | Device Marking Code | Nominal Zener Voltage @ IZT | IZT (mA) | VZ AVE.(V) | VZ MIN.(V) | VZ MAX.(V) | Maximum Zener Impedance | ZZT MAX.() @ IZT | ZZK MAX.() @ IZK | Maximum Reverse Leakage Current | IZK(mA) | IR(uA) @ VR | VR(V) | IZMmA |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1SMA5919BT3G-CN | 2H8 | 5.6 | 10 | 5.32 | 5.88 | 89.5 | 2.5 | 500 | 1.00 | 323.0 | 2.0 |
Dimensions (DO-214AC/SMA)
| Dimension | Inches | (mm) |
|---|---|---|
| Body Length | 0.208 - 0.177 | (5.30 - 4.50) |
| Body Width | 0.067 - 0.051 | (1.70 - 1.30) |
| Terminal Diameter | 0.012 - 0.006 | (0.305 - 0.152) |
| Overall Length | 0.188 MAX. | (4.80 MAX.) |
| Terminal Length | 0.098 MAX. | (2.50 MAX.) |
| Terminal to Terminal | 0.078(2.00) | (2.00) |
Package Information
| Package | Reel Size | Q'TY/Reel | Box Size (mm) | QTY/Box (Kpcs) | Carton Size (mm) | Q'TY/Carton (Kpcs) |
|---|---|---|---|---|---|---|
| SMA | 13' | 5000 | 360*360*360 | 15 | 355*310*310 | 120 |
Suggested Soldering Temperature Profile
Recommended reflow methods: IR, vapor phase oven, hot air oven, wave solder. The device can be exposed to a maximum temperature of 265C for 10 seconds. Devices can be cleaned using standard industry methods and solvents. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Suggested Pad Layout
| Unit | Symbol | A | B | C | D | E |
|---|---|---|---|---|---|---|
| (inch) | 0.154 | 0.066 | 0.095 | 0.215 | 0.060 | |
| (mm) | 3.91 | 1.68 | 2.41 | 5.45 | 1.52 |
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