Commercial grade common cathode diode DIOTEC BAV23CC with RoHS and Conflict Minerals compliance features
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The BAV23 series comprises SMD small signal diodes designed for high-speed switching, signal processing, and rectifying applications. These diodes feature high reverse voltage, superfast recovery, low junction capacitance, and low leakage current. They are compliant with RoHS, REACH, and Conflict Minerals regulations, making them suitable for commercial-grade applications. Available in various configurations including single diode, common cathode, common anode, and series connection, these diodes are packaged in SOT-23 (TO-236) and supplied taped and reeled.
Product Attributes
- Brand: Diotec Semiconductor AG
- Package: SOT-23 (TO-236)
- Compliance: RoHS, REACH, Conflict Minerals
- Grade: Commercial grade
- Packaging: Taped and reeled (3000 / 7)
Technical Specifications
| Specification | BAV23I | BAV23CA | BAV23CC | BAV23SE |
|---|---|---|---|---|
| Models | Single Diode | Common Anode | Common Cathode | Series Connection |
| Dimensions (mm) | 2.4 x 1.3 0.1 (Body), 1.1 +0.1 (Height), 0.4 +0.1 (Lead), 2.9 0.1 (Pitch) | |||
| Weight (approx.) | 0.01 g | |||
| Maximum Average Forward Current (IFAV) | 225 mA (single diode loaded), 125 mA (both diodes loaded) | |||
| Non-Repetitive Peak Forward Surge Current (IFSM) | 1.7 A (tp 10 ms), 3 A (tp 100 s), 9 A (tp 1 s) | |||
| Repetitive Peak Reverse Voltage (VRRM) | 250 V | |||
| DC Reverse Voltage (VR) | 200 V | |||
| Junction Temperature (Tjmax) | 150C | |||
| Storage Temperature (Ts) | -55...+150C | |||
| Power Dissipation (Ptot) | 350 mW (per device, mounted on 3 mm copper pads) | |||
| Forward Voltage (VF) | < 1 V (IF = 100 mA, Tj = 25C), < 1.25 V (IF = 200 mA, Tj = 25C) | |||
| Leakage Current (IR) | < 100 nA (VR = 200 V, Tj = 25C), < 100 A (VR = 200 V, Tj = 150C) | |||
| Junction Capacitance (CT) | < 5 pF (VR = 0 V, f = 1 MHz) | |||
| Reverse Recovery Time (trr) | < 50 ns (IF = 30 mA, IR = 30 mA, IR(rec) = 3 mA) | |||
| Thermal Resistance (RthA) | < 357 K/W (junction to ambient air, mounted on P.C. board with 3 mm copper pad at each terminal) | |||
| Solder & Assembly Conditions | 260C / 10s, MSL = 1 | |||
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