Surface Mount Diode FUXINSEMI 1N4148W-D1 SOD123FL Package Suitable for Reflow Soldering Applications
Price:
Negotiable
MOQ:
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Delivery Time:
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Product Description
Product Overview
The 1N4148W-D1 is a surface-mount device designed for reflow soldering applications. It is packaged in a SOD-123FL and is supplied on a reel for automated assembly processes. The device is suitable for soldering processes with specific thermal profiles, including preheating and peak temperature considerations.
Product Attributes
- Brand: Fuxin (implied by www.fuxinsemi.com)
- Package Type: SOD-123FL
- Configuration: Surface Mounted Device
- Reel Taping: Yes
Technical Specifications
| Specification | Value |
|---|---|
| Model Number | 1N4148W-D1 |
| Package | SOD-123FL |
| Soldering Condition - Average ramp-up rate (Tsmin to Tsmax) | <3 C/sec |
| Soldering Condition - Preheat Temperature (Tsmin) | 150 C |
| Soldering Condition - Preheat Temperature (Tsmax) | 200 C |
| Soldering Condition - Preheat Time (tsmin to tsmax) | 60~120 sec |
| Soldering Condition - Ramp-up Rate (Tsmax to Tl) | <3 C/sec |
| Soldering Condition - Temperature Maintained Above Tl | 217 C |
| Soldering Condition - Time Maintained Above Tl (tL) | 60~260 sec |
| Soldering Condition - Peak Temperature (Tp) | 255 C |
| Soldering Condition - Time within 5C of actual Peak Temperature (tp) | 10~30 sec |
| Soldering Condition - Ramp-down Rate | <6 C/sec |
| Soldering Condition - Time 25C to Peak Temperature | <6 minutes |
| Storage Environment - Temperature | 5 ~40 C |
| Storage Environment - Humidity | 55%25% |
| Dimensions (implied by SOD-123FL context) | 5.4 x 2.13 mm (approximate, based on typical SOD-123FL dimensions and provided numbers 54 and 2.13) |
| Lead Diameter (implied by 0.039) | 0.039 inches (approximate) |
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