Surface mount device assembly component FUXINSEMI MBRB41H100CTT4G-FS featuring detailed reflow soldering thermal profiles
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The MBRB41H100CTT4G-FS is a component designed for electronic applications. It is presented with detailed soldering conditions and suggested thermal profiles for reflow soldering processes, indicating its use in surface-mount device assembly. The product is associated with Fuxinsemi.
Product Attributes
- Brand: Fuxinsemi
Technical Specifications
| Specification | Value |
|---|---|
| Model | MBRB41H100CTT4G-FS |
| Soldering Conditions (Reflow Soldering) | |
| Average ramp-up rate (Tsmin to Tsmax) | < 3 C/sec |
| Preheat - Temperature Min (Tsmin) | 150 C |
| Preheat - Temperature Max (Tsmax) | 200 C |
| Preheat - Time (tsmin to tsmax) | 60~120 sec |
| Ramp-up Rate (Tsmax to TL) | < 3 C/sec |
| Time maintained above: Temperature (TL) | 217 C |
| Time maintained above: Time (tL) | 60~260 sec |
| Peak Temperature (TP) | 255 C |
| Time within 5 C of actual Peak Temperature (tP) | 10~30 sec |
| Ramp-down Rate | < 6 C/sec |
| Time 25 C to Peak Temperature | < 6 minutes |
| Storage Environment | |
| Temperature | 5 ~ 40 C |
| Humidity | 55% 25% |
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Company
Hefei Purple Horn E-Commerce Co., Ltd.
Location
Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person
Sellina