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High speed switching Infineon IKA08N65F5 IGBT with soft antiparallel diode and RoHS compliant design

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Product Description

Product Overview

The IKA08N65F5 is a high-speed 5th generation FAST IGBT from Infineon, featuring TRENCHSTOPTM 5 technology and copacked with a RAPID 1 fast and soft antiparallel diode. This DuoPack offers best-in-class efficiency in hard switching and resonant topologies, a 650V breakdown voltage, and low QG. It is qualified according to JEDEC for target applications and is Pb-free and RoHS compliant. The device is suitable for applications requiring high-speed switching.

Product Attributes

  • Brand: Infineon
  • Technology: TRENCHSTOPTM 5
  • Diode Type: RAPID 1
  • Certifications: JEDEC qualified, RoHS compliant
  • Lead Plating: Pb-free

Technical Specifications

TypeVCEICVCEsat, Tvj=25CTvjmaxMarkingPackage
IKA08N65F5650V8A1.6V175CK08EEF5PG-TO220-3 FP

Maximum Ratings

ParameterSymbolValueUnitConditions
Collector-emitter voltageVCE650VDC
DC collector current, limited by TvjmaxIC10.8 / 6.8ATC = 25C / 100C
Pulsed collector current, tp limited by TvjmaxICpuls24.0A
Turn off safe operating area- 24.0AVCE 650V, Tvj 175C
Diode forward current, limited by TvjmaxIF12.3 / 7.3ATC = 25C / 100C
Diode pulsed current, tp limited by TvjmaxIFpuls24.0A
Gate-emitter voltageVGE20V
Transient Gate-emitter voltage (tp 10s, D 30V
Power dissipationPtot31.2 / 15.6WTC = 25C / 100C
Operating junction temperatureTvj-40...+175C
Storage temperatureTstg-55...+150C
Soldering temperature, wave soldering 1.6mm (0.063in.) from case for 10s260C
Mounting torque, M3 screw0.6NmMaximum of mounting processes

Thermal Resistance

ParameterSymbolConditionsMax. ValueUnit
IGBT thermal resistance, junction - caseRth(j-c)4.80K/W
Diode thermal resistance, junction - caseRth(j-c)5.60K/W
Thermal resistance junction - ambientRth(j-a)65K/W

Electrical Characteristics

ParameterSymbolConditionsmin.typ.max.Unit
Static Characteristic
Collector-emitter breakdown voltageV(BR)CESVGE = 0V, IC = 0.20mA650--V
Collector-emitter saturation voltageVCEsatVGE = 15.0V, IC = 8.0A, Tvj = 25C--1.60V
VGE = 15.0V, IC = 8.0A, Tvj = 125C--1.80
VGE = 15.0V, IC = 8.0A, Tvj = 175C--2.10
Diode forward voltageVFVGE = 0V, IF = 9.0A, Tvj = 25C--1.45V
VGE = 0V, IF = 9.0A, Tvj = 125C--1.40
VGE = 0V, IF = 9.0A, Tvj = 175C--1.40
Gate-emitter threshold voltageVGE(th)IC = 0.08mA, VCE = VGE3.24.04.8V
Zero gate voltage collector currentICESVCE = 650V, VGE = 0V, Tvj = 25C--40.0A
VCE = 650V, VGE = 0V, Tvj = 175C--4000.0
Gate-emitter leakage currentIGESVCE = 0V, VGE = 20V--100nA
TransconductancegfsVCE = 20V, IC = 8.0A-17.0-S
Dynamic Characteristic
Input capacitanceCiesVCE = 25V, VGE = 0V, f = 1MHz-500-pF
Output capacitanceCoesVCE = 25V, VGE = 0V, f = 1MHz-16-pF
Reverse transfer capacitanceCresVCE = 25V, VGE = 0V, f = 1MHz-3-pF
Gate chargeQGVCC = 520V, IC = 8.0A, VGE = 15V-22.0-nC
Switching Characteristic, Inductive Load
IGBT Characteristic, at Tvj = 25C
Turn-on delay timetd(on)VCC = 400V, IC = 4.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-10-ns
Rise timetrVCC = 400V, IC = 4.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-5-ns
Turn-off delay timetd(off)VCC = 400V, IC = 4.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-116-ns
Fall timetfVCC = 400V, IC = 4.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-20-ns
Turn-on energyEonVCC = 400V, IC = 4.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-0.07-mJ
Turn-off energyEoffVCC = 400V, IC = 4.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-0.02-mJ
Total switching energyEtsVCC = 400V, IC = 4.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-0.09-mJ
IGBT Characteristic, at Tvj = 25C
Turn-on delay timetd(on)VCC = 400V, IC = 2.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-9-ns
Rise timetrVCC = 400V, IC = 2.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-3-ns
Turn-off delay timetd(off)VCC = 400V, IC = 2.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-129-ns
Fall timetfVCC = 400V, IC = 2.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-35-ns
Turn-on energyEonVCC = 400V, IC = 2.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-0.04-mJ
Turn-off energyEoffVCC = 400V, IC = 2.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-0.02-mJ
Total switching energyEtsVCC = 400V, IC = 2.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-0.06-mJ
Diode Characteristic, at Tvj = 25C
Diode reverse recovery timetrrVR = 400V, IF = 4.0A, diF/dt = 800A/s-41-ns
Diode reverse recovery chargeQrrVR = 400V, IF = 4.0A, diF/dt = 800A/s-0.14-C
Diode peak reverse recovery currentIrrmVR = 400V, IF = 4.0A, diF/dt = 800A/s-6.6-A
Diode peak rate of fall of reverse recovery current during tbdirr/dtVR = 400V, IF = 4.0A, diF/dt = 800A/s--160-A/s
Diode reverse recovery timetrrVR = 400V, IF = 2.0A, diF/dt = 800A/s-27-ns
Diode reverse recovery chargeQrrVR = 400V, IF = 2.0A, diF/dt = 800A/s-0.10-C
Diode peak reverse recovery currentIrrmVR = 400V, IF = 2.0A, diF/dt = 800A/s-6.2-A
Diode peak rate of fall of reverse recovery current during tbdirr/dtVR = 400V, IF = 2.0A, diF/dt = 800A/s--300-A/s
IGBT Characteristic, at Tvj = 150C
Turn-on delay timetd(on)VCC = 400V, IC = 4.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-9-ns
Rise timetrVCC = 400V, IC = 4.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-6-ns
Turn-off delay timetd(off)VCC = 400V, IC = 4.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-145-ns
Fall timetfVCC = 400V, IC = 4.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-18-ns
Turn-on energyEonVCC = 400V, IC = 4.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-0.10-mJ
Turn-off energyEoffVCC = 400V, IC = 4.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-0.03-mJ
Total switching energyEtsVCC = 400V, IC = 4.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-0.13-mJ
IGBT Characteristic, at Tvj = 150C
Turn-on delay timetd(on)VCC = 400V, IC = 2.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-9-ns
Rise timetrVCC = 400V, IC = 2.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-4-ns
Turn-off delay timetd(off)VCC = 400V, IC = 2.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-165-ns
Fall timetfVCC = 400V, IC = 2.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-25-ns
Turn-on energyEonVCC = 400V, IC = 2.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-0.06-mJ
Turn-off energyEoffVCC = 400V, IC = 2.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-0.02-mJ
Total switching energyEtsVCC = 400V, IC = 2.0A, VGE = 0.0/15.0V, RG(on) = 48.0, RG(off) = 48.0, L = 30nH, C = 30pF-0.08-mJ
Diode Characteristic, at Tvj = 150C
Diode reverse recovery timetrrVR = 400V, IF = 4.0A, diF/dt = 800A/s-56-ns
Diode reverse recovery chargeQrrVR = 400V, IF = 4.0A, diF/dt = 800A/s-0.27-C
Diode peak reverse recovery currentIrrmVR = 400V, IF = 4.0A, diF/dt = 800A/s-7.5-A
Diode peak rate of fall of reverse recovery current during tbdirr/dtVR = 400V, IF = 4.0A, diF/dt = 800A/s--134-A/s
Diode reverse recovery timetrrVR = 400V, IF = 2.0A, diF/dt = 800A/s-42-ns
Diode reverse recovery chargeQrrVR = 400V, IF = 2.0A, diF/dt = 800A/s-0.19-C
Diode peak reverse recovery currentIrrmVR = 400V, IF = 2.0A, diF/dt = 800A/s-7.4-A
Diode peak rate of fall of reverse recovery current during tbdirr/dtVR = 400V, IF = 2.0A, diF/dt = 800A/s--240-A/s

Applications

  • Solar converters
  • Uninterruptible power supplies
  • Welding converters
  • Mid to high range switching frequency converters

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