Surface Mount Diode KUU SS2200 with High Forward Surge Current and Molded Plastic Body Construction
Product Overview
This series of diodes, designed for surface-mounted applications, features a metal silicon junction for majority carrier conduction, resulting in low power loss and high efficiency. They are ideal for automated placement due to built-in strain relief and high forward surge current capability. The diodes are constructed with a molded plastic body and tinned leads, suitable for high-temperature soldering.
Product Attributes
- Case: JEDEC DO-214AC molded plastic body
- Terminals: leads solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
- Mounting Position: Any
- Weight: 0.070 grams
- Flammability Classification: Underwriters Laboratory 94V-0
Technical Specifications
| Catalog Number | VRRM (Volts) | VRMS (Volts) | VDC (Volts) | I(AV) (Amps) | IFSM (Amps) | VF (Volts) | IR (mA) | CJ (pF) | RJA (C/W) | TJ, TSTG (C) |
| SS22 | 20 | 14 | 20 | 2.0 | 20 | 0.55 | 0.5 | 20 | 75.0 | -65 to +150 |
| SS23 | 30 | 21 | 30 | 2.0 | 20 | 0.55 | 0.5 | 20 | 75.0 | -65 to +150 |
| SS24 | 40 | 28 | 40 | 2.0 | 20 | 0.55 | 0.5 | 20 | 75.0 | -65 to +150 |
| SS25 | 50 | 35 | 50 | 2.0 | 20 | 0.55 | 0.5 | 20 | 75.0 | -65 to +150 |
| SS26 | 60 | 42 | 60 | 2.0 | 20 | 0.55 | 0.5 | 20 | 75.0 | -65 to +150 |
| SS28 | 80 | 56 | 80 | 2.0 | 20 | 0.55 | 0.5 | 20 | 75.0 | -65 to +150 |
| SS210 | 100 | 70 | 100 | 2.0 | 20 | 0.55 | 0.5 | 20 | 75.0 | -65 to +150 |
| SS2150 | 150 | 105 | 150 | 2.0 | 20 | 0.70 | 0.5 | 20 | 75.0 | -65 to +150 |
| SS2200 | 200 | 140 | 200 | 2.0 | 20 | 0.95 | 0.5 | 20 | 75.0 | -65 to +150 |
Notes:
1. Measured at 1MHz and applied reverse voltage of 4.0V D.C.
2. P.C.B. mounted with 0.2x0.2 (5.0x5.0mm) copper pad areas.
Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz, resistive or inductive load, for capacitive load current derate by 20%.
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