High reliability Littelfuse IXYS MEK350-02DA common cathode diode module with soft recovery behavior
Product Overview
The IXYS MEK 350-02DA is a Common Cathode Fast Recovery Epitaxial Diode (FRED) module designed for high-frequency switching applications. It features an international standard package with a DCB ceramic base plate, planar passivated chips, and short recovery times, leading to low switching losses and soft recovery behavior. This module ensures high reliability circuit operation with low voltage peaks, reduced protection circuit requirements, low noise switching, and minimal losses. It is ideal for use as an antiparallel diode in high-frequency switching devices, a free-wheeling diode in converters and motor control circuits, and in applications such as inductive heating, melting, uninterruptible power supplies (UPS), ultrasonic cleaners, and welders.
Product Attributes
- Brand: IXYS
- Package: Y4-M6
- Base Plate Material: DCB Ceramic
- Chip Technology: Planar Passivated
- Recovery Behavior: Soft Recovery
- Backside: Isolated
Technical Specifications
| Symbol | Definition | Conditions | Min. | Typ. | Max. | Unit |
|---|---|---|---|---|---|---|
| VRRM | Max. repetitive reverse voltage | TVJ = 25C | 200 | V | ||
| IFAVM | Average forward current | TC = 75C, TVJ = 150C, rectangular, d = 0.5 | 356 | A | ||
| trr | Max. reverse recovery time | IF = 350 A; -diF/dt = 200 A/s, TVJ = 100C | 150 | ns | ||
| VF | Forward voltage | IF = 150 A, TVJ = 125C | 0.80 | V | ||
| RthJC | Thermal resistance junction to case | 0.085 | K/W | |||
| RthCH | Thermal resistance junction to heatsink | 0.143 | K/W | |||
| IFSM | Max. surge forward current | t = 8.3 ms (60 Hz), sine, TVJ = 45C | 2.64 | kA | ||
| I2t | I2t value for fusing | t = 8.3 ms (60 Hz), sine, TVJ = 45C | 29.3 | kAs | ||
| VISOL | Isolation voltage | t = 1 minute, 50/60 Hz, RMS; IISOL < 1 mA | 3000 | V | ||
| Weight | Weight | 126 | g | |||
| MD | Mounting torque | 2.25 | 2.75 | Nm | ||
| MT | Terminal torque | 4.5 | 5.5 | Nm | ||
| dSpp/Apb | Creepage distance on surface | Terminal to backside | 10.0 | 16.0 | mm | |
| dSpb/Apb | Striking distance through air | Terminal to terminal | 14.0 | 16.0 | mm | |
| TVJ | Virtual junction temperature | -40 | 150 | C | ||
| Top | Operation temperature | -40 | 125 | C | ||
| Tstg | Storage temperature | -40 | 125 | C |
Dimensions (Y4-M6 Package)
| Dim. | min [mm] | max [mm] | min [inch] | max [inch] |
|---|---|---|---|---|
| a | 30.0 | 30.6 | 1.181 | 1.205 |
| b | 64.0 | 65.0 | 2.520 | 2.559 |
| c | ||||
| d | 6.5 | 7.0 | 0.256 | 0.275 |
| e | 4.9 | 5.1 | 0.193 | 0.201 |
| h | 93.5 | 94.5 | 3.681 | 3.720 |
| i | 79.5 | 80.5 | 3.130 | 3.169 |
| k | 33.4 | 34.0 | 1.315 | 1.339 |
| l | 16.7 | 17.3 | 0.657 | 0.681 |
| m | 22.7 | 23.3 | 0.894 | 0.917 |
| n | 22.7 | 23.3 | 0.894 | 0.917 |
| o | 14.0 | 15.0 | 0.551 | 0.591 |
| p | typ. 0.25 | typ. 0.010 |
Note: Dimensions 'c' and 'p' are not explicitly defined with min/max values in the provided text.
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