LGE RABS210 molded plastic diode offering 2 amperes current and 1000 volts voltage for pcb applications

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Product Description

Product Overview

This product features a glass-passivated junction, making it ideal for printed circuit board applications. It offers reliable, low-cost construction using molded plastic techniques and high-temperature soldering capabilities up to 260C for 10 seconds. The device is characterized by its small size, simple installation, pure tin plated terminals (lead-free), and high surge current capability. It is suitable for applications requiring a voltage range of 1000 Volts and a current of 2.0 Amperes.

Product Attributes

Material: Molded plastic body, Pure tin plated terminal
Lead Free: Yes
Solderable Leads: Per MIL-STD-202, Method 208
Mounting Position: Any
Weight: 0.12 grams

Technical Specifications

Characteristic	Symbol	Value	Unit	Notes
Maximum Recurrent Peak Reverse Voltage	VRRM	1000	V
Maximum RMS Voltage	VRMS	700	V
Maximum DC Blocking Voltage	VDC	1000	V
Maximum Average Forward Rectified Current	I(AV)	2.0	A	@ TA=40
Peak Forward Surge Current	IFSM	50	A	8.3ms Single Half Sine-Wave Super Imposed on Rated Load (JEDEC Method)
Maximum Forward Voltage	VF	1.3	V	at 1.0A DC
Maximum DC Reverse Current	IR	10	A	@ TJ=25 at Rated DC Blocking Voltage
Maximum DC Reverse Current	IR	500	A	@ TJ=125 at Rated DC Blocking Voltage
I2t Rating for Fusing	I2t	14.94	A2s	(t<8.3ms)
Typical Junction Capacitance	CJ	25	pF	Per Element (Note 2) Measured at 1.0MHz and applied reverse voltage of 4.0V DC
Typical Thermal Resistance	RJA	40	/W	From junction to ambient mounted on P.C.B with 0.50.5"(1313mm) copper pads. (Note 3)
Operating Temperature Range	TJ	-55 to +150
Storage Temperature Range	TSTG	-55 to +150
Maximum Reverse Recovery Time	Trr	500	ns	Reverse Recovery Test Conditions:IF=0.5A,IR=1.0A,IRR=0.25A. (Note 1)