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Switching 1200V Field Stop Trench IGBT MagnaChip Semicon MBQ40T120QESTH Featuring Ultra Soft Fast Recovery Diode

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Price: Negotiable
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Product Description

Product Overview

The Magnachip MBQ40T120QESTH is a high-speed 1200V Field Stop Trench IGBT designed for applications requiring efficient switching and low power loss. Leveraging Magnachip's advanced Field Stop Trench IGBT Technology, this device offers a low VCE(SAT) of 2.1V at 40A, high switching performance, and excellent quality. It features an ultra-soft, fast recovery anti-parallel diode with ultra-narrowed VF distribution control and a positive temperature coefficient for easy paralleling. Ideal for PFC, UPS, and inverter applications, this IGBT provides reliable performance in demanding industrial environments.

Product Attributes

  • Brand: Magnachip Semiconductor Ltd.
  • Technology: Field Stop Trench IGBT
  • Diode Type: Ultra-Soft, fast recovery anti-parallel diode
  • Package Type: TO-247
  • Certifications: Halogen Free
  • Revision: 1.2 (Jul. 2021)

Technical Specifications

Symbol Characteristics Conditions Min Typ Max Unit
Absolute Maximum Ratings
VCES Collector-emitter voltage 1200 V
VGE Gate-emitter voltage 20 V
IC DC collector current, limited by Tvjmax TC=25C 80 A
IC DC collector current, limited by Tvjmax TC=100C 40 A
ICpuls Pulsed collector current, tp limited by Tjvjmax 160 A
IF Diode forward current, limited by Tvjmax TC=25C 80 A
IF Diode forward current, limited by Tvjmax TC=100C 40 A
IFpuls Diode pulsed current, Pulse time limited by Tjmax 160 A
PD Power dissipation TC=25C 428 W
PD Power dissipation TC=100C 214 W
tSC Short circuit withstand time VCE = 500V, VGE = 15V, TC = 150C 3 s
Tvj Operating Junction temperature range -40 ~175 C
Tstg Storage temperature range -55 ~150 C
Thermal Characteristics
Rth(j-a) Thermal resistance junction-to-ambient 40 C/W
Rth(j-c) Thermal resistance junction-to-case for IGBT 0.35
Rth(j-c) Thermal resistance junction-to-case for Diode 0.8
Electrical Characteristics (Tvj = 25C unless otherwise specified)
BVCES Collector-emitter breakdown voltage IC = 1mA, VGE = 0V 1200 - - V
VCE(sat) Collector-emitter saturation voltage IC = 40A, VGE= 15V, Tvj = 25C - 2.1 2.7 V
VCE(sat) Collector-emitter saturation voltage IC = 40A, VGE= 15V, Tvj = 175C - 2.75 - V
VF Diode forward voltage VGE = 0V, IF = 40A, Tvj = 25C - 1.95 2.50 V
VF Diode forward voltage VGE = 0V, IF = 40A, Tvj = 175C - 2.05 - V
VGE(th) Gate-emitter threshold voltage VCE = VGE, IC = 1mA 4.0 5.0 6.0 V
ICES Zero gate voltage collector current VCE = 1200V, VGE = 0V - - 1 mA
IGES Gate-emitter leakage current VGE = 20V, VCE = 0V - - 250 nA
Dynamic Characteristics
Qg Total gate charge VCE = 960V, IC = 40A, VGE = 15V - 428 - nC
Qge Gate-emitter charge - 56 -
Qgc Gate-collector charge - 232 -
Cies Input capacitance VCE = 30V, VGE = 0V, f = 1MHz - 6780 - pF
Coes Output capacitance - 158 - pF
Cres Reverse transfer capacitance - 86 - pF
Switching Characteristics (Tvj = 25C)
td(on) Turn-on delay time VGE = 15V, VCC = 600V, IC = 40A, RG = 10, Inductive Load - 74 - ns
tr Rise time - 114 - ns
td(off) Turn-off delay time - 178 - ns
tf Fall time - 95 - ns
Eon Turn-on switching energy - 5.13 - mJ
Eoff Turn-off switching energy - 0.77 - mJ
Ets Total switching energy - 5.90 - mJ
Switching Characteristics (Tvj = 175C)
td(on) Turn-on delay time VGE = 15V, VCC = 600V, IC = 40A, RG = 10, Inductive Load - 67 - ns
tr Rise time - 122 - ns
td(off) Turn-off delay time - 193 - ns
tf Fall time - 134 - ns
Eon Turn-on switching energy - 7.47 - mJ
Eoff Turn-off switching energy - 1.44 - mJ
Ets Total switching energy - 8.91 - mJ
Diode Characteristics
trr Reverse recovery time IF = 40A, diF/dt = 300A/ s, Tvj = 25C - 285 - ns
Irr Reverse recovery current - 15 - A
Qrr Reverse recovery charge - 2.09 - uC
trr Reverse recovery time IF = 40A, diF/dt = 300A/ s, Tvj = 175C - 472 - ns
Irr Reverse recovery current - 20 - A
Qrr Reverse recovery charge - 4.55 - uC

Package Dimensions (TO-247)

Dimension Min(mm) Max(mm)
A 4.70 5.31
A1 2.20 2.60
A2 1.50 2.49
b 0.99 1.40
b1 2.59 3.43
b2 1.65 2.39
c 0.38 0.89
D 20.30 21.46
D1 13.08 -
E 15.45 16.26
E1 13.06 14.02
E2 4.32 5.49
e 5.45BSC
L 19.81 20.57
L1 - 4.50
P 3.50 3.70
Q 5.38 6.20
S 6.15BSC

Note: Package body size, length and width do not include mold flash, protrusions and gate burrs.

Disclaimer: The Products are not designed for use in hostile environments, including, without limitation, aircraft, nuclear power generation, medical appliances, and devices or systems in which malfunction of any Product can reasonably be expected to result in a personal injury. Sellers customers using or selling Sellers products for use in such applications do so at their own risk and agree to fully defend and indemnify Seller. Magnachip reserves the right to change the specifications and circuitry without notice at any time. Magnachip does not consider responsibility for use of any circuitry other than circuitry entirely included in a Magnachip product. is a registered trademark of Magnachip Semiconductor Ltd.


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