Compact molded plastic diode MSKSEMI DB104S with high temperature tolerance and 1 amp forward current

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Product Description

Product Overview

The MSKSEMI DB101S-DB107S series are ideal for printed circuit board applications, offering reliable, low-cost construction using a molded plastic technique. These diodes are designed for high-temperature soldering (260C/10 seconds at 5 lbs. tension), feature a small size for simple installation, and possess high surge current capability.

Product Attributes

Brand: MSKSEMI
Construction: Molded plastic
Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
Mounting Position: Any
Weight: 0.02 ounce, 0.4 grams

Technical Specifications

Parameter	SYMBOLS	DB101S	DB102S	DB103S	DB104S	DB105S	DB106S	DB107S	UNITS
Maximum repetitive peak reverse voltage	RRM	50	100	200	400	600	800	1000	V
Maximum RMS voltage	VRMS	35	70	140	280	420	560	700	V
Maximum DC blocking voltage	VDC	50	100	200	400	600	800	1000	V
Maximum average forward rectified current at TC=40C	IF(AV)	1.0							A
Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load (JEDEC Method)	IFSM	50							A
Maximum instantaneous forward voltage drop per leg at 1A	VF	1.1							V
Maximum DC reverse current at rated DC blocking voltage TA=25C	IR	10							A
Maximum DC reverse current at rated DC blocking voltage TA=100C	IR	500							A
Operating temperature range	TJ	-55 to +150							C
Storage temperature range	TSTG	-55 to +150							C