Dual channel transistor orisilicon OSM15N10X2 optimized for low gate charge and continuous current handling
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The OSM15N10 X2 is a dual-channel device featuring low on-resistance, continuous current capability, low gate charge, low gate voltage, and high current conduction capability. It is suitable for applications such as load switching and control. The device is housed in a package.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Not specified
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Parameter | Value | Conditions |
| On-resistance | Not specified | At VGS = 20V |
| Continuous Current | Not specified | Not specified |
| Gate Charge | Low | Not specified |
| Gate Voltage | Low | Not specified |
| Current Conduction Capability | High | Not specified |
| Package Type | OSM15N10 X2 | Not specified |
| Absolute Maximum Ratings | Not specified | Exceeding these ratings may cause permanent damage. Ratings are for stress only, not functional operation. Long-term operation at maximum ratings can affect reliability. Ratings are for individual application, not combined use. Junction temperature above limit will damage chip. Monitoring ambient temperature does not guarantee exceeding rated temperature limits. In high power dissipation/poor thermal resistance applications, maximum ambient temperature may need to be reduced. In moderate power dissipation/low thermal resistance applications, maximum ambient temperature can exceed maximum limits as long as junction temperature is within rated limits. |
| Junction Temperature (TJ) | Calculated | TJ = TA + (PD * RJA) |
| RJA (Junction-to-Ambient Thermal Resistance) | Not specified | Based on layer board modeling and calculation methods. Varies with material, layout, and environmental conditions. Rated based on layer circuit board. Refer to and for detailed information. |
| Junction-to-Board Thermal Characteristics (RJB) | Not specified | Based on layer board modeling and calculation methods. Refer to and for detailed information. |
| RJA vs. RJB | RJA measures power flowing along multiple thermal paths. RJB involves only one path. RJA includes convection from package top and radiation from package, making it more useful in real applications. | Not specified |
| Junction Temperature (TJ) | Calculated | TJ = TB + (PD * RJB) |
| Worst-Case Conditions | Device soldered to board for surface mount package. | Not specified |
| Product Marking | 15N10X2 YMLLL | 1. PIN1 2. 15N10 = Device Name 3. Y = Year 4. M = Month 5. LLL = Trace No |
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Hefei Purple Horn E-Commerce Co., Ltd.
Location
Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person
Sellina