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SG2M012075HJ 750V Silicon Carbide MOSFET with Low On Resistance and Temperature Independent Losses

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Product Description

Product Overview

The SG2M012075HJ is a 750V Silicon Carbide (SiC) Power MOSFET from Qingchun Semiconductor (Ningbo) Co., Ltd. Designed for high-speed switching applications, it offers very low switching losses, fully controllable dv/dt, and high blocking voltage with low on-resistance. Its fast intrinsic diode with low reverse recovery (Qrr) and temperature-independent turn-off switching losses contribute to efficiency improvements and reduced cooling requirements. This RoHS compliant and halogen-free component is ideal for on-board chargers/PFC, EV battery chargers, booster/DC-DC converters, and switch-mode power supplies, enabling increased power density and higher system switching frequencies.

Product Attributes

  • Brand: Qingchun Semiconductor (Ningbo) Co., Ltd.
  • Material: Silicon Carbide (SiC)
  • Channel Type: N Channel Enhancement
  • Compliance: Halogen free, RoHS compliant

Technical Specifications

Type VDS IDS (TC = 25) RDS(on), typ (VGS = 18V, ID = 88A, TJ = 25) TJ,max Marking Package
SG2M012075HJ 750V 160A 12m 175 SG2M012075HJ TO-247-4L
Symbol Parameter Value Unit Test Conditions Note
VDS,max Drain source voltage 750 V VGS = 0V, ID = 100A
VGS,max Gate source voltage -8 /+22 V Absolute maximum values Note1
VGSop Gate source voltage -4 /+18 V Recommended operational values
ID Continuous drain current 160 A VGS = 18V, TC = 25C Fig.19
ID Continuous drain current 114 A VGS = 18V, TC = 100C
ID(pulse) Pulsed drain current 320 A Pulse width tP limited by TJ,max Fig.22
PD Power dissipation 517 W TC= 25C,TJ = 175C Fig.20
TJ ,Tstg Operating Junction and storage temperature -55 to +175 C
TL Soldering temperature 260 C 1.6mm (0.063) from case for 10s
TM Mounting torque 1 8.8 Nm lbf-in M3 or 6-32 screw
Rth(j-c) Thermal resistance from junction to case 0.23 C/W Fig.21
V(BR)DSS Drain-source breakdown voltage 750 V VGS = 0V, ID = 100A
VGS(th) Gate threshold voltage 2.3 V VDS = VGS, ID = 26mA Fig.11
VGS(th) Gate threshold voltage 2.8 V VDS = VGS, ID = 26mA TJ = 175C
IDSS Zero gate voltage drain current 1 A VDS = 750V, VGS = 0V
IGSS Gate source leakage current 100 nA VGS = 18V, VDS = 0V
RDS(on) Current drain-source on-state resistance 12 m VGS = 18V, ID = 88A Fig.4,5, 6
RDS(on) Current drain-source on-state resistance 20 m VGS = 18V, ID = 88A, TJ = 175C
gfs Transconductance 70 S VDS = 20V, ID = 88A Fig.7
gfs Transconductance 61 S VDS = 20V, ID = 88A, TJ = 175C
Rg,int Internal gate resistance 2.6 VAC = 25mV, f = 1MHz, open drain
Ciss Input capacitance 6886 pF VDS = 500V, VGS = 0V TJ = 25C, VAC = 25mV f = 100kHz Fig.17, 18
Coss Output capacitance 343
Crss Reverse capacitance 15
Eoss Coss stored energy 51 J Fig.16
Qgs Gate source charge 73 nC VDS = 500V, VGS = -4/+18V ID = 88A Fig.12
Qgd Gate drain charge 51
Qg Gate charge 214
Eon Turn on switching energy 1013 J VDS = 500V, VGS = -4/+18V ID = 88A, Rg = 2.5 L = 16.7H Fig.26
Eoff Turn off switching energy 461
tdon Turn on delay time 29 ns Fig.27
tr Rise time 44
tdoff Turn off delay time 58
tf Fall time 16
VSD Diode forward voltage 4.3 V VGS = -4V, ISD = 44A Fig.8,9, 10
VSD Diode forward voltage 3.9 V VGS = -4V, ISD = 44A TJ = 175C
IS Continuous diode forward current 108 A VGS = -4V, Tc = 25C Note2
trr Reverse recovery time 28 ns VR = 500V, VGS = -4V ISD = 88A di/dt = 4283A/s TJ = 175C
Qrr Reverse recovery charge 900 nC
Irrm Peak reverse recovery current 56 A

Package Drawing

TO-247-4L-A


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