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SG2M023120J1J Silicon Carbide MOSFET Featuring High Blocking Voltage and Low Reverse Recovery Charge

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Product Description

Product Overview

The SG2M023120J1J is a 1200V Silicon Carbide (SiC) Power MOSFET designed for high-speed switching applications. It offers very low switching losses, fully controllable dv/dt, and high blocking voltage with low on-resistance. The device features a fast intrinsic diode with low reverse recovery charge (Qrr) and temperature-independent turn-off switching losses. These characteristics lead to reduced cooling efforts, improved efficiency, increased power density, and the ability to increase system switching frequency. It is suitable for applications such as on-board chargers/PFC, EV battery chargers, booster/DC-DC converters, and switch mode power supplies.

Product Attributes

  • Brand: (Sichain Semiconductor)
  • Product Line: TriQSiCTM
  • Material: Silicon Carbide (SiC)
  • Channel Type: N Channel Enhancement
  • Certifications: RoHS compliant, REACH compliant

Technical Specifications

Type VDS (V) IDS (A) RDS(on), typ (m) TJ,max (C) Marking Package
SG2M023120J1J 1200 107 (TC = 25C) 23 (VGS = 18V, ID = 49A, TJ = 25C) 175 SG2M023120J1J TO-263-7L
Symbol Parameter Value Unit Test Conditions Note
VDS,max Drain source voltage 1200 V VGS = 0V, ID = 100A
VGS,max Gate source voltage -8 /+22 V Absolute maximum values Note1
VGSop Gate source voltage -4 /+18 V Recommended operational values
ID Continuous drain current 107 A VGS = 18V, TC = 25C Fig.19
ID Continuous drain current 76 A VGS = 18V, TC = 100C
ID(pulse) Pulsed drain current 214 A Pulse width limited by TJ,max Fig.22
PD Power dissipation 484 W TC= 25C,TJ = 175C Fig.20
TJ ,Tstg Operating Junction and storage temperature -55 to +175 C
TL Soldering temperature 260 C 1.6mm (0.063) from case for 10s
Rth(j-c) Thermal resistance from junction to case 0.25 - 0.31 C/W Fig.21
V(BR)DSS Drain-source breakdown voltage 1200 V VGS = 0V, ID = 100A
VGS(th) Gate threshold voltage 2.3 - 3.6 V VDS = VGS, ID = 14mA Fig.11
VGS(th) Gate threshold voltage 2.1 V VDS = VGS, ID = 14mA, TJ = 175C
IDSS Zero gate voltage drain current 1 - 10 A VDS = 1200V, VGS = 0V
IGSS Gate source leakage current 100 nA VGS = 18V, VDS = 0V
RDS(on) Current drain-source on-state resistance 28 - 38 m VGS = 15V, ID = 49A Fig.4,5, 6
RDS(on) Current drain-source on-state resistance 44 m VGS = 15V, ID = 49A, TJ = 175C
RDS(on) Current drain-source on-state resistance 23 - 31 m VGS = 18V, ID = 49A
RDS(on) Current drain-source on-state resistance 42 m VGS = 18V, ID = 49A, TJ = 175C
gfs Transconductance 36 S VDS = 20V, ID = 49A Fig.7
gfs Transconductance 33 S VDS = 20V, ID = 49A, TJ = 175C
Rg,int Internal gate resistance 4.6 VAC = 25mV, f = 1MHz, open drain
Ciss Input capacitance 2780 pF VDS = 1000V, VGS = 0V, TJ = 25C, VAC = 25mV, f = 100kHz Fig.17, 18
Coss Output capacitance 147 pF
Crss Reverse capacitance 7.4 pF
Eoss Coss stored energy 81 J Fig.16
Qgs Gate source charge 28 nC VDS = 800V, VGS = -4/+18V, ID = 49A Fig.12
Qgd Gate drain charge 26 nC
Qg Gate charge 95 nC
Eon Turn on switching energy 652 J VDS = 800V, VGS = -4/+18V, ID = 49A, Rg = 2.5, L = 16.7H Fig.26
Eoff Turn off switching energy 186 J
tdon Turn on delay time 25 ns Fig.27
tr Rise time 14 ns
tdoff Turn off delay time 42 ns
tf Fall time 11 ns
VSD Diode forward voltage 3.7 V VGS = -4V, ISD = 24.5A Fig.8,9, 10
VSD Diode forward voltage 3.3 V VGS = -4V, ISD = 24.5A, TJ = 175C
IS Continuous diode forward current 107 A VGS = -4V, Tc = 25C Note2
trr Reverse recovery time 29 ns VR = 800V, VGS = -4V, ISD = 49A, di/dt = 3510A/s, TJ = 175C
Qrr Reverse recovery charge 448 nC
Irrm Peak reverse recovery current 27 A

Package Drawing

TO-263-7L-B


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