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1200V Silicon Carbide Power MOSFET Sichainsemi SG2M040120JH Low Reverse Recovery Low On Resistance Device

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Product Description

Product Overview

The SG2M040120JH is a 1200V Silicon Carbide (SiC) Power MOSFET designed for high-speed switching applications. It offers very low switching losses, IGBT-compatible driving voltage, and fully controllable dv/dt. This MOSFET features a high blocking voltage with low on-resistance and a fast intrinsic diode with low reverse recovery. Its performance characteristics lead to reduced cooling efforts, improved efficiency, increased power density, and the ability to operate at higher system switching frequencies. Key applications include on-board chargers, EV battery chargers, booster/DC-DC converters, and switch-mode power supplies.

Product Attributes

  • Brand: (Sichain Semiconductor)
  • Material: Silicon Carbide (SiC)
  • Package Type: TO-263-7L
  • Compliance: Halogen free, RoHS compliant
  • Certifications: RoHS

Technical Specifications

Type VDS (Max) IDS (TC = 25) RDS(on), typ (VGS = 15V, ID = 32A, TJ = 25) TJ,max Marking Package
SG2M040120JH 1200V 73A 40m 175 SG2M040120JH TO-263-7L

Key Performance Parameters

Symbol Parameter Value Unit Test Conditions Note
VDS,max Drain source voltage 1200 V VGS = 0V, ID = 100A
VGS,max Gate source voltage -8 /+19 V Absolute maximum values Note1
VGSop Gate source voltage -4 /+15 V Recommended operational values
ID Continuous drain current 73 A VGS = 15V, TC = 25C Fig.19
ID Continuous drain current 52 A VGS = 15V, TC = 100C
ID(pulse) Pulsed drain current 146 A Pulse width tP limited by TJ,max Fig.22
PD Power dissipation 365 W TC= 25C,TJ = 175C Fig.20
TJ ,Tstg Operating Junction and storage temperature -55 to +175 C
TL Soldering temperature 260 C 1.6mm (0.063) from case for 10s
Rth(j-c) Thermal resistance from junction to case 0.33 C/W Fig.21
V(BR)DSS Drain-source breakdown voltage 1200 V VGS = 0V, ID = 100A
VGS(th) Gate threshold voltage 2.3 V VDS = VGS, ID = 9mA Fig.11
VGS(th) Gate threshold voltage 2.8 V VDS = VGS, ID = 9mA TJ = 175C
VGS(th) Gate threshold voltage 3.6 V VDS = VGS, ID = 9mA
IDSS Zero gate voltage drain current 1 A VDS = 1200V, VGS = 0V
IGSS Gate source leakage current 100 nA VGS = 15V, VDS = 0V
RDS(on) Current drain-source on-state resistance 40 m VGS = 15V, ID = 32A Fig.4,5, 6
RDS(on) Current drain-source on-state resistance 68 m VGS = 15V, ID = 32A, TJ = 175C
gfs Transconductance 22 S VDS = 20V, ID = 32A Fig.7
gfs Transconductance 20 S VDS = 20V, ID = 32A, TJ = 175C
Ciss Input capacitance 2171 pF VDS = 1000V, VGS = 0V TJ = 25C, VAC = 25mV f = 100kHz Fig.17, 18
Coss Output capacitance 109 pF
Crss Reverse capacitance 3.8 pF
Eoss Coss stored energy 56 J Fig.16
Qgs Gate source charge 22 nC VDS = 800V, VGS = -4/+15V ID = 32A Fig.12
Qgd Gate drain charge 20 nC
Qg Gate charge 64 nC
Eon Turn on switching energy 261 J VDS = 800V, VGS = -4/+15V ID = 32A, Rg = 2.2 L = 100H Fig.26
Eoff Turn off switching energy 44 J
tdon Turn on delay time 17 ns Fig.27
tr Rise time 6 ns
tdoff Turn off delay time 18 ns
tf Fall time 8 ns
VSD Diode forward voltage 3.8 V VGS = -4V, ISD = 16A Fig.8,9, 10
VSD Diode forward voltage 3.3 V VGS = -4V, ISD = 16A TJ = 175C
IS Continuous diode forward current 73 A VGS = -4V, Tc = 25C Note2
trr Reverse recovery time 23 ns VR = 800V, VGS = -4V ISD = 32A di/dt = 3276A/s TJ = 175C
Qrr Reverse recovery charge 200 nC
Irrm Peak reverse recovery current 20 A

Notes:

  • Note 1: when using MOSFET Body Diode VGS,max = -4 / +19V
  • Note 2: When using SiC Body Diode the maximum recommended VGS = -4V

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Company Hefei Purple Horn E-Commerce Co., Ltd.
Location Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person Sellina

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