HP-IR3DS-6 Double Layer Infrared Curing Oven Thermal Curing System
Price:
Negotiable
MOQ:
1 unit
Delivery Time:
30 working days
Brand:
Haipai
Product Description
HP-IR3DS-6 Double-Layer Infrared Curing Oven
The HP-IR3DS-6 Double-Layer Infrared Curing Oven is an advanced thermal curing system engineered for high-volume SMT production environments requiring maximum throughput and precise temperature control.
System Overview
This innovative double-layer design features six independent temperature zones—three upper tracks and three lower tracks—effectively doubling curing capacity compared to single-layer systems while maintaining a compact footprint. The double-layer configuration allows manufacturers to process two separate PCB streams simultaneously, dramatically increasing production throughput without expanding floor space.
Key Features
- Six independent temperature zones with PID control via touch screen interface
- Precise thermal profiling from room temperature to 100°C
- Six heating tubes per zone for uniform heat distribution
- Double-layer design doubles curing capacity in same footprint
- Rapid warm-up time under 15 minutes minimizes downtime
- Energy-efficient design with thick insulation reduces power consumption
- Durable T1.5 steel plate welded construction
Ideal for thermally-cured conformal coatings, adhesives, and encapsulants in high-volume SMT production environments.
Technical Specifications
| Parameter | Specification |
|---|---|
| Model | HP-IR3DS-6 |
| External Dimensions (L*W*H) | L3000mm * W1080mm * H1300mm |
| Weight | Approx. 580 kg |
| Control Method | PLC + Touch Screen |
| PCB Transfer Height | 910±20mm |
| Conveyor Speed | 0.5-3.5m/min adjustable |
| Transfer Motor | Stepper motor |
| Conveyor Type | Chain conveyor (35B 5mm extended pin stainless steel chain) |
| PCB Width | MAX: 450mm |
| Rail Width Adjustment | Electrically adjustable, 50-450mm |
| Number of Temperature Zones | 6 total (3 upper tracks + 3 lower tracks) |
| Heating Tubes per Zone | 6 pieces |
| Temperature Control Range | Room temperature - 100°C |
| Warm-up Time | <15 minutes |
| Max PCB Size | L450mm * W450mm |
| Component Clearance | ±110mm max |
| Cover Opening Method | Software control, electric lifting |
| Frame Construction | T1.5 steel plate welded |
| Power Supply | AC380V, 50Hz, 3-phase 5-wire |
| Total Power | 19KW |
| Interface | SMEMA |
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Get in Touch
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Company
Shenzhen Haipai Holding Co., Ltd
Location
No.1303, Building 2, Kechuang Workshop, No.6 Songjiang Road, Shapu Community, Songgang Sub-district，Bao'an District, Shenzhen.
Contact Person
Mary Yang