HP-RF3C 3-Zone Hot Air Curing Ovens High Volume PCB Thermal Curing Oven
Price:
Negotiable
MOQ:
1 unit
Delivery Time:
30 working days
Brand:
Haipai
Product Description
HP-RF3C 3-Zone Hot Air Curing Oven
High-Volume PCB Thermal Curing System
The HP-RF3C Hot Air Curing Oven is an advanced thermal curing system engineered for high-volume SMT production environments requiring extended curing times or higher throughput. With its 3000mm total length and three independent hot air temperature zones, this system provides superior flexibility for thermal profiling compared to shorter or fewer-zone models.
Advanced Three-Zone Thermal Control
The three-zone design enables sophisticated thermal profiles impossible with simpler systems:
- Gradual preheat in Zone 1
- Controlled soak in Zone 2
- Final cure in Zone 3
This configuration optimizes results for materials requiring specific temperature ramps and dwell times. Each zone features independent PID temperature control integrated with the PLC + touch screen interface, enabling precise temperature settings from room temperature to 120°C.
Superior Heating Technology
The advanced heating system combines heating elements with hot air fans to achieve exceptional temperature uniformity across the entire curing chamber. Heating elements provide primary thermal energy, while forced hot air circulation ensures even distribution—eliminating hot spots and cold zones that can compromise curing quality. This combination is particularly effective for curing complex assemblies where uniform heat exposure is critical.
High-Throughput Performance
The extended 3000mm furnace body provides ample space for multi-stage thermal profiles at productive conveyor speeds up to 3.5m/min, or enables longer curing times at standard speeds for thick coatings and challenging materials. The <10 minute warm-up time minimizes downtime between production runs.
Technical Specifications
| Model | HP-RF3C |
| External Dimensions (L*W*H) | L3000mm * W1080mm * H1300mm |
| Weight | Approx. 530 kg |
| Control Method | PLC + Touch Screen |
| PCB Transfer Height | 910±20mm |
| Conveyor Speed | 0.5-3.5m/min adjustable |
| Transfer Motor | Stepper motor |
| Conveyor Type | Chain conveyor (35B 5mm extended pin stainless steel chain) |
| PCB Width | MAX: 450mm |
| Rail Width Adjustment | Electrically adjustable, 50-450mm |
| Number of Temperature Zones | 3 hot air temperature zones |
| Temperature Control Range | Room temperature - 120°C |
| Warm-up Time | <10 minutes |
| Max PCB Size | L450mm * W450mm |
| Component Clearance | ±110mm max |
| Cover Opening Method | Software control, electric lifting |
| Heating System | Heating elements + hot air fans |
| Frame Construction | T1.5 steel plate welded |
| Power Supply | AC380V, 50Hz, 3-phase 5-wire |
| Total Power | 9.5KW |
| Interface | SMEMA |
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Company
Shenzhen Haipai Holding Co., Ltd
Location
No.1303, Building 2, Kechuang Workshop, No.6 Songjiang Road, Shapu Community, Songgang Sub-district，Bao'an District, Shenzhen.
Contact Person
Mary Yang