Customized for micro precision electronic parts with a size range of 0.1–30mm.

Widely applied in 3C electronics, optoelectronic packaging, semiconductor, automotive electronics and other industries.

It realizes automatic feeding and high-precision positioning for special-shaped, gold-plated and fragile thin-wall components, replacing traditional vibrating bowls and manual feeding processes.

• Ultra-high Precision: Micron-level positioning and feeding to meet strict precision assembly tolerances.
• Damage-free Handling: Gentle feeding design avoids scratches, plating peeling and cracking, fully protecting coated and fragile parts.
• Strong Compatibility: Flexible feeding for micro, special-shaped and special material components with wide versatility.
• Automatic Upgrade: Replace manual operation and traditional vibratory feeders, effectively eliminating jamming and surface abrasion issues.
• Stable & Efficient: Adopts XYZ module precise motion to ensure stable continuous feeding and adapt to mass production lines.

  Name	XYZ Module Feeding & Arranging Machine
  Overall dimensions	750mm*550mm*800mm
  Air pressure	0.5-0.7Mpa
  Itinerary	X/250mm;Y/400mm;Z/65mm
  Power supply power	1.2KW
  load	0.5KG
  Feeder size	180mm*120mm*20mm
  Placement range	250mm*200mm
  Repeatability accuracy	±0.025mm
  weight	95KG