Copper Clad Laminates

RT/duroid® 6202 Copper Clad Laminate: Engineered for Exceptional Electrical and Mechanical Stability RT/duroid® 6202 is a high-performance, ceramic-filled PTFE composite laminate designed to deliver outstanding electrical stability and robust mechanical properties for demanding microwave and RF applications. It builds upon the legacy of the RT/duroid 6000 series, offering designers a material with a tightly controlled, low dielectric constant, minimal signal loss, and

F4BM265 Copper Clad Laminate: A Tunable, High-Performance Substrate for Demanding RF Applications The F4BM265, part of the F4BM/F4BME series from Taizhou Wangling Insulation Material Factory, is a PTFE (polytetrafluoroethylene) and woven glass fabric reinforced laminate engineered to provide a robust and customizable foundation for high-frequency circuit design. By precisely adjusting the ratio of low-loss PTFE resin to glass cloth, this material achieves a stable mid-range

RT/duroid 6202PR Copper Clad Laminate: Engineered for Embedded Resistor and Precision RF Applications RT/duroid® 6202PR is a specialized high-frequency laminate designed to integrate seamlessly with embedded resistor foil technology, providing a unified, high-performance substrate for complex RF and microwave circuits. This material combines the proven electrical stability of the RT/duroid 6000 series with a formulation optimized for precision resistive layers, enabling the

F4BM265 PTFE/Glass Fiber Copper Clad Laminate: A Cost-Effective High-Frequency Solution The F4BM265 is a high-performance PTFE (polytetrafluoroethylene) and woven glass fiber reinforced copper clad laminate developed by Taizhou Wangling Insulation Material Factory. It is designed as a domestically produced, high-value alternative to international high-frequency circuit materials, offering a balanced combination of stable electrical properties, good mechanical strength, and

RT/duroid® 6002 Copper Clad Laminate: The Standard for High-Reliability Microwave Designs RT/duroid® 6002 is a pioneering low-loss, low-dielectric constant microwave laminate that has set the benchmark for electrical stability and mechanical reliability in complex high-frequency circuits. As one of the first materials of its kind, it continues to be a preferred choice for engineers designing demanding microwave structures where consistent electrical performance and robust

CLTE-MW™ Copper Clad Laminate: Engineered for Millimeter-Wave & 5G Circuitry CLTE-MW™ represents a specialized advancement in high-frequency circuit materials, specifically engineered to address the unique demands of 5G, millimeter-wave (mmWave), and other high-density RF applications. As a ceramic-filled, woven glass reinforced PTFE composite, this laminate is designed to deliver cost-effective, high-performance solutions where precise thickness control, low loss, and stable

CLTE-XT™ High-Frequency Copper Clad Laminate: Optimized for Advanced RF Performance CLTE-XT™ represents an evolution in high-frequency circuit materials, engineered to deliver enhanced electrical performance while maintaining robust mechanical and thermal reliability. As an advanced variant within the proven CLTE series, this PTFE-based laminate is specifically designed for demanding RF and microwave applications that require ultra-low signal loss, improved thermal stability

CLTE Copper Clad Laminate: High-Performance High-Frequency Circuit Material CLTE™ is a high-frequency circuit laminate engineered for applications demanding exceptional dimensional stability, low thermal expansion, and consistent electrical performance. As a proven PTFE-based material, it is particularly well-suited for advanced radio frequency (RF) and microwave circuits, including embedded resistor technologies, ground-based and airborne communications systems, and radar

F4BME233 High-Frequency Copper Clad Laminate Description The F4BME233 is a specialized, glass fiber-reinforced PTFE (Polytetrafluoroethylene) copper clad laminate engineered for demanding microwave and radio frequency (RF) applications where a balance of low loss, moderate dielectric constant, and superior signal integrity is paramount. Manufactured by Taizhou Wangling Insulation Material Factory, this material belongs to the enhanced "E" series, distinguished by its use of

F4BME220 High-Frequency Copper Clad Laminate Description The F4BME220 is a high-performance, glass fiber-reinforced PTFE (Polytetrafluoroethylene) copper clad laminate manufactured by Taizhou Wangling Insulation Material Factory. Designed for advanced microwave and radio frequency (RF) applications, this material offers a superior combination of stable electrical properties, excellent reliability, and high cost-effectiveness, positioning it as a competitive alternative to

Taizhou Wangling Insulation Material Factory F4BM233 PTFE Fiberglass Cloth Copper Clad Laminate Overview The F4BM233 is a key model within the Taizhou Wangling Insulation Material Factory's F4BM series of high-performance Polytetrafluoroethylene (PTFE) fiberglass cloth copper clad laminates. This product is specifically engineered for advanced microwave and RF applications that demand high frequency stability and low loss, making it an ideal substrate for critical components

DiClad® 870 Copper-Clad Laminate: The Benchmark for Low-Loss, High-Frequency Circuitry We are proud to present the DiClad® 870, a premier woven fiberglass/PTFE laminate from Rogers Corporation, renowned for its exceptional electrical performance and reliability in demanding RF and microwave applications. Engineered with precise control of the fiberglass-to-PTFE ratio, DiClad 870 is specifically designed to provide an optimal balance of low dielectric constant, ultra-low loss,

We are pleased to offer our 2-layer PCB, constructed with Rogers RO4725JXR(https://www.circuitboardpcbs.com/sale-14172268-ro4725jxr-antenna-pcb-built-on-30-7mil-0-78mm-substrates-with-double-layer-copper-and-immersion-gold.html), a high-performance laminate designed to meet the stringent requirements of antenna and high-frequency applications. With its low dielectric constant, low loss characteristics, and excellent passive intermodulation (PIM) performance, this PCB is ideal

We proudly present our 2-layer PCB, constructed with Rogers RO4533 laminate(https://www.circuitboardpcbs.com/sale-14172071-ro4533-pcb-for-antenna-high-frequency-pcb-60mil-rogers-4533-pcb-double-layer-immersion-gold-circuit-.html), a high-performance material designed for mobile infrastructure and RF applications. With its low dielectric constant, low loss performance, and excellent passive intermodulation (PIM) response, this PCB is ideal for applications like cellular base

TLX-0 Copper-Clad Laminate: The Ultra-Low Loss, High-Reliability Workhorse for Demanding RF/Microwave Designs We are pleased to present TLX-0, a premier woven fiberglass-reinforced PTFE laminate from AGC, engineered to deliver exceptional low-loss performance and robust mechanical reliability for high-volume, mission-critical RF and microwave applications. As the member of the versatile TLX family with the lowest dielectric constant and dissipation factor, TLX-0 is designed

DiClad® 527 Copper-Clad Laminate: Engineered for Superior Stability in Demanding RF Applications We proudly offer the DiClad® 527, a high-performance woven fiberglass/PTFE laminate engineered by Rogers Corporation to deliver exceptional dimensional stability and reliable electrical properties for critical RF and microwave circuits. As part of the esteemed DiClad series, this material is specifically formulated with a higher fiberglass-to-PTFE ratio, providing mechanical

IsoClad® 933 Copper-Clad Laminate: The Optimized Choice for Conformal and Low-Loss RF Designs We are pleased to introduce the IsoClad® 933, a premium high-frequency laminate engineered to deliver an exceptional balance of mechanical flexibility, electrical performance, and isotropic stability. Part of Rogers Corporation's renowned IsoClad series, this material utilizes a unique nonwoven fiberglass reinforcement within a PTFE matrix, setting it apart from traditional woven

RT/duroid® 5870 Copper-Clad Laminate: Precision and Performance for Demanding High-Frequency Designs As your trusted supplier, we are pleased to offer the exceptional RT/duroid® 5870, a premier high-frequency laminate from Rogers Corporation engineered for the most critical RF and microwave applications. This material represents the gold standard for designers who require a perfect balance of stable electrical properties, mechanical integrity, and superior processability in

RT/duroid® 5880 Copper-Clad Laminate: The Benchmark for Low-Loss, High-Frequency Circuitry RT/duroid® 5880 is a cornerstone high-frequency laminate from Rogers Corporation, renowned for its exceptional electrical performance and reliability in demanding RF and microwave applications. It is a glass microfiber-reinforced polytetrafluoroethylene (PTFE) composite specifically engineered for precision stripline and microstrip circuits. The key to its performance lies in the

RT/duroid® 5880LZ Copper-Clad Laminate: A High-Performance Solution for Demanding RF/Microwave Applications RT/duroid® 5880LZ is a high-frequency laminate engineered by Rogers Corporation specifically for precision stripline and microstrip circuits. It belongs to a family of filled polytetrafluoroethylene (PTFE) composites, distinguished by a unique filler system that yields a low-density, lightweight material. This makes it particularly advantageous for weight-sensitive,