Electronics X Ray Machine

X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: It is broadly utilized in a variety of fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, the Photovoltaic Industry, among others. APPLICATION of IC Xray machine AX7900: Large-Scale Inspection Table with Laser Pinpointing for Precise Localization High-Precision

UNICOMP AX9100VS X-ray Inspection System Advanced 3D reconstruction technology for high-accuracy defect analysis in PCBA PTH capacitor inspection and comprehensive semiconductor production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, and Flip Chip inspection Automotive Components and New Energy Industry Aluminum Die Casting and Molded Plastic components Ceramic Products and other special industries Key Features Precise detection inspection of tiny

Full-Angle Rotary Inspection Semiconductor PCBA Production X-ray UNICOMP AX9100VS Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die Casting, Molded Plastic; Ceramic Products and other special industries. Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction

Full-angle Rotary Detection Precise Geometric Magnification Chip Production X-ray UNICOMP AX9100 Advanced X-ray inspection system designed for precise geometric magnification and comprehensive chip production analysis with full-angle rotary detection capabilities. Applications SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor and Packaging components Battery Industry and Electronic components Auto parts and Photovoltaic Industry Aluminum Die-casting and Moulding Plastic

X-Ray Inspection Equipment for Electric Razor Description of IC X Ray machine AX7900: It finds extensive application in numerous domains, encompassing BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small-scale metal casting, electronic connector modules, cables, aerospace components, and the photovoltaic industry, among others. FEATURES of IC Xray machine AX7900: A Large-Scale Laser Pinpoint Inspection Table for Accurate LocalizationAchievin

High Performance X-Ray Machine Unicomp AX7900 for PCB Electronic Components Inspection The Unicomp AX7900 is a high-performance X-ray inspection system specifically designed for PCB electronic components, offering advanced imaging capabilities for quality control and failure analysis. Product Overview Features a 90KV 5μm X-ray tube with FPD detector and multi-function workstation. Includes XY multi-axis movement standard with ±60° tilt motion (optional). Z-axis movement for X

Laptop Battery Internal Defect X-Ray Equipment UNICOMP AX9100MAX The UNICOMP AX9100MAX Lithium-ion Battery Testing System is a high-precision semiconductor X-ray inspection system optimized for non-destructive testing of electronics and battery modules. System Overview Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic

7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with

AX7900 Real Time Auto-Offline X Ray Machine For Electronics Inner Defect Inspection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1215(L)x1325(W)x1700(H)mm Weight 1240kg Power

UNICOMP AX9600 160kV Microfocus X-ray Inspection System The UNICOMP AX9600 160KV microfocus X-ray inspection system features a proprietary 160kV high-power open-type microfocus X-ray tube, achieving an ultra-fine focal spot of merely 0.8 μm. With maximum geometric magnification of 2000* and superior X-ray penetrability, this system enables precise void fraction quantification for TVS diodes and serves as a high-accuracy inspection solution for advanced IC packaging, HBM

UNICOMP AX9100VS X-ray Inspection System High Resolution Geometric Magnification All-in-one Scan SMT Component Inspection X-ray System System Overview Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip Inspection Automotive Components and New Energy Industry Aluminum Die Casting and Molded Plastic Components Ceramic Products and Other Special

AX7900 with function of tilting ±25° for better inspection effect Description of IC X Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 600mm

AX9100MAX Semiconductor X-Ray Inspection System Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components with micro-focus 2D/2.5D imaging technology. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules, precision castings, automotive

AX8300MAX X-ray Inspection System Advanced 5μm minimum PCB PTH plated through hole inspection equipment with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 110kV sealed tube technology with maximum 47.7X geometric magnification for PCBA inspection. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection

Semiconductor AX8300MAX Unicomp QFN Internal Void Defect Analyzer Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Key Features Professional

UNICOMP AX9100VS X-ray Inspection System Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die Casting, Molded Plastic; Ceramic Products and other special industries. Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction Synchronized 7-axis manipulation with any

AX8300MAX X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features CNC auto scanning function with 5μm minimum resolution for fingerprint access control, SMT, and BGA component inspection. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded

UNICOMP AX9100 X-ray Inspection System Rotary Detection Precise Geometric Magnification Chip Production X-ray UNICOMP AX9100 IC Inspection System Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with navigation mode detection 7 axis linkage with 70 degree tilt detection capability

AX8300MAX 110kV Offline X-ray Inspection System Advanced industrial X-ray inspection system specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic components, new energy core parts, aluminum die

AX9100MAX Battery Module Quality Check Equipment Off-line programming system optimized for high-precision non-destructive testing of laptop battery layer gaps and comprehensive inspection of battery modules using advanced micro-focus 2D/2.5D imaging technology. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules, precision castings, automotive connectors, wiring harnesses, and photovoltaic