Electronics X Ray Machine
Compact size Electronics X Ray Machine with moving wheels CX3000
Compact size Electronics X Ray Machine with moving wheels CX3000 Application of SMT X-Ray machine BGA, CSP, LED, Flip Chip, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Aerospace Components, Photovoltaic Industry, Other Special Industries. FEATURES of Desktop X-ray machine 1. Super Compack and Desk-top Design 2. Multi-function X-Ray Inspection 3. Different Inspection Mode 4. Status Light and Emergency Button 5. Safety Electromagnetic
AX8200max Electronics X Ray Machine With 6-axis 360 Degree Rotation Optional
Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
FPD 90KV X Ray Inspection Equipment For Wire Harness Defects Detection
FPD 90KV X Ray Inspection System for Wire Harness defects Detection Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area
Unicomp X-ray system AX7900 for internal defect inspection of Electronic Components
Unicomp X-Ray inspection machine AX7900 for BGA inspection of Electronic Components FEATURES of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option). Motion controls include X/Y table motion plus Z-axis tube and detector movement, ±60° tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm x
FPD Detector 90KV X Ray Inspection Equipment For Switch Inner Defect Detection
FPD 90KV X Ray Inspection Equipment for Switch Inner Defect Detection Description of IC X Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area
2D Microfocus X Ray Machine For IC Semicon Lead Frame Inspection With CE FDA
2D microfocus X Ray machine for IC semicon Lead frame inspection with CE FDA compliance FEATURES of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option). Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm
Unicomp 5um 90KV X Ray with FPD oblique view for Semicon IC wire bonding sweeping check
Unicomp 5um 90KV X Ray with FPD oblique view for Semicon IC wire bonding sweeping check Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size 85μm
90KV 5um microfocus X-ray system with high resolution FPD for PCBA BGA soldering void checking
90KV 5um microfocus X-ray system with high resolution FPD for PCBA BGA soldering void checking Specifications of SMT Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
90kv Real-time High Precision X Ray Machine Unicomp AX7900 For PCBA Quality Control
90kv real-time high precision X ray machine Unicomp AX7900 for PCBA quality control Description of IC X Ray machine AX7900: It is extensively used in various industries, encompassing BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor production, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, as well as Photovoltaics. FEATURES of IC Xray machine AX7900: Laser Pinpoint for Precise Location on Large-Scale Inspection Tables
Digital Radiography Machine & X Ray Machine Unicomp AX7900 For Pcb Repair And IC/BGA Ball Soldering Measurement&testing
Digital Radiography machine & x ray machine Unicomp AX7900 for pcb repair and IC/BGA ball soldering measurement&testing Description of IC X Ray machine AX7900: It is widely adopted across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductor production, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics. FEATURES of IC Xray machine AX7900: Large Size Inspection Table
Unicomp Desktop X-ray System CX3000 For Internal Defect Inspection Of Electronic Components
Compact size Electronics X Ray Machine with moving wheels CX3000 Application of SMT X-Ray machine BGA, CSP, LED, Flip Chip, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Aerospace Components, Photovoltaic Industry, Other Special Industries. FEATURES of Desktop X-ray machine 1. Super Compack and Desk-top Design 2. Multi-function X-Ray Inspection 3. Different Inspection Mode 4. Portable with Wheels 5. Status Light and Emergency Button 6.
90kV 5μm Resolution Bonding Wire Semiconductor Xray Tester CX3000 Unicomp Gold Bond Inspection Equipment
CX300 Unicomp Gold Bond Inspection Equipment 90kV 5μm Resolution Bonding Wire Semiconductor X-ray Tester for precise inspection and quality control. Applications BGA, CSP, LED, Flip Chip, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Aerospace Components, Photovoltaic Industry, and other specialized industries. Key Features Super Compact Desktop Design Multi-function X-Ray Inspection Multiple Inspection Modes Portable with Wheels Status
Desktop Offline Real Time X Ray Machine High Precision For Electronics Components
Desktop Offline Real Time X-Ray Machine High Precision For Electronics Components OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales service team to
FPD 90KV X Ray Inspection System 48mm X 54mm For PCBA Defect Inspection
FPD 90KV X-Ray Inspection System for PCBA Defect Inspection Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary
Deep Penetration Imaging Internal Porosity Defect Checking Die casting X-ray AX9600 Unicomp
Deep Penetration Imaging Internal Porosity Defect Checking Die Casting X-ray AX9600 Unicomp The UNICOMP AX9600 high-power micro-focus X-ray inspection system delivers ultra-precision non-destructive testing for advanced semiconductor and electronic components, featuring deep penetration imaging for internal porosity and defect detection in die casting applications. Applications Specifically designed for high-end semiconductor and electronic component inspection, the AX9600
High Precision LED X-ray AX9600 Unicomp Optoelectronics Manufacturing Tester
High Precision LED X-ray AX9600 Unicomp Optoelectronics Manufacturing Tester The UNICOMP AX9600 features a self-developed 160kV high-power open micro-focus X-ray tube, delivering an ultra-small 0.8μm focal spot. With exceptional magnification up to 2000 times and outstanding ray penetration capacity, it accurately measures void ratio of TVS diodes, and is ideal for high-precision quality inspection of advanced IC packaging, HBM memory chips and GPU semiconductor components.
90KV Industrial X-ray Inspection Machine AX7900 for LED Lamp Bead Solder Void and Wire Breakage UNICOMP
90KV Industrial X-ray Inspection Machine AX7900 for LED Lamp Bead Solder Void and Wire Breakage UNICOMP Product Overview The AX7900 industrial X-ray inspection system features a high-performance 90kV X-ray tube with 5μm ultra-high resolution and a high-sensitivity FPD flat-panel detector. Built with a multifunctional precision workstation, the system includes standard multi-axis XY motion and supports optional ±60° tilting movement for flexible multi-angle inspection.
CNC Auto Batch Inspection BGA Editmode X-ray AX9100 UNICOMP Electronics PCBA Processing Inspection System
CNC Auto Batch Inspection BGA Editmode X-ray AX9100 UNICOMP Electronics PCBA Processing Inspection System Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1000X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function
Full-angle Rotary Detection Precise Geometric Magnification Chip Production X-ray UNICOMP AX9100
Full-angle Rotary Detection Precise Geometric Magnification Chip Production X-ray UNICOMP AX9100 Advanced X-ray inspection system designed for precise geometric magnification and comprehensive chip production analysis with full-angle rotary detection capabilities. Applications SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor and Packaging components Battery Industry and Electronic components Auto parts and Photovoltaic Industry Aluminum Die-casting and Moulding Plastic
Design Internal Packaging Flaw Inspection LED X-ray AX9100 UNICOMP Optoelectronics Manufacturing Tester
AX9100 UNICOMP Optoelectronics Manufacturing Tester Advanced X-ray inspection system designed for internal packaging flaw detection in LED manufacturing and optoelectronics applications. Applications SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor and Packaging components Battery Industry and Electronic components Auto parts and Photovoltaic Industry Aluminum Die-casting and Moulding Plastic Ceramics and Other Special Industries Technical Specifications System