HongRuiXing (Hubei) Electronics Co.,Ltd.
                                                                                                           
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China FBGA/PBGA/LGA IC Substrate Manufacturing - 25μm Line Width, 0.29mm Thickness, 4-Layer Customizable for sale

FBGA/PBGA/LGA IC Substrate Manufacturing - 25μm Line Width, 0.29mm Thickness, 4-Layer Customizable

Price Negotiable
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
Product Description
IC Substrate Manufacturing Capabilities
HOREXS specializes in advanced IC substrate manufacturing for semiconductor packaging applications, supporting various package types including FBGA, PBGA, LGA, and other advanced configurations.
Applications
Semiconductor packaging, IC substrates, memory modules (uMCP, MCP, UFS), CMOS, MEMS, and IC assembly. Serving industries including smartphones, laptops, tablets, gaming devices, automotive electronics, wearables, servers, and RF/wireless applications.
Technical Specifications
Parameter Specification
Minimum Line Space/Width 1 mil (25μm)
Finished Thickness 0.29mm
Material Brands SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic
Surface Finish Immersion gold (standard), OSP, immersion silver, tin (customizable)
Copper Weight 0.5oz or customizable
Layers 4 layers (customizable)
Soldermask Green (standard), customizable (TAIYO INK brand)
Manufacturing Capabilities
  • Annual production capacity: 600,000 square meters
  • Tenting & SAP process technologies
  • Advanced line/space capability: 20/20μm, 10/10μm
  • Support for BT+ABF materials
  • Wire bonding substrates and embedded memory IC substrates
  • Build-up technology with buried/blind vias
  • Flipchip CSP and other ultra IC package substrates
Inquiry Requirements
  • Complete substrate production specifications
  • Gerber files and drilling files
  • Quantity requirements including samples
  • Layer stack-up information for multilayer substrates
Factory Overview
HOREXS-Hubei operates from a 60,000 square meter facility with over $300 million USD investment, positioning as one of China's leading IC substrate manufacturers with world-class production capabilities.
Shipping & Logistics
Global shipping support via DHL, UPS, FedEx, and air freight services.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company HongRuiXing (Hubei) Electronics Co.,Ltd.
Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person Mark Liu

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