JEDEC IC Trays

Durable JEDEC IC tray reduces dust contamination in wafer packaging. Made of MPPO with 1.0×10⁴-1.0×10¹¹ Ω resistance. Custom cavity layouts available. Compliant with cleanroom standards for automated production lines.

High Capacity JEDEC IC Trays feature a deep cavity design and PPE anti-static material for secure placement of large semiconductor modules. Custom pocket options available. Provides stable support and effective transport damage prevention for ESD-sensitive devices.

Durable PPE anti-static JEDEC IC tray with ESD protection, heat resistance up to 180°C, and strong impact resistance. Ideal for automotive, industrial, and consumer semiconductor logistics. Custom cavity options and OEM/ODM available.

Specialized JEDEC IC tray with ultra-low particle generation and stable ESD protection for cleanroom wafer level packaging. Custom cavity design available. Reliable chip protection for semiconductor manufacturing and transport.

Custom JEDEC IC trays with ESD protection for semiconductor factories. Made of conductive MPPO, resistance 1.0×10⁴–1.0×10¹¹ Ω. Stackable design saves space. High precision, low warpage. Accept OEM/ODM. Ideal for IC packaging, testing, and logistics.

Precision-machined JEDEC tray for fine pitch ICs ≤0.5 mm. ESD-safe with surface resistance 1E4-1E11 Ω. Compatible with automated handling systems. Fully customizable pockets for secure positioning and long lifecycle. Ideal for QFN, BGA, CSP packaging.

Durable ESD-safe JEDEC tray for IC logistics and storage. Reusable, stackable design reduces waste and costs. Compliant with JEDEC standards, ensures precise chip alignment for automated handling. Custom pocket options available. Ideal for semiconductor transport and warehousing.

High-precision JEDEC tray with V-groove cavities, anti-static and ESD-safe MPPO material. Minimizes particle contamination and chip damage. Ideal for fine-pitch ICs, BGA, and CSP packages. Custom pocket options available. Supports OEM/ODM.

Custom JEDEC IC tray made of MPPO anti-static material for cleanroom use. Lightweight, stable structure with 108 cavities protects chips from contamination and damage. Supports OEM/ODM custom pocket options. Ideal for semiconductor fabs and ESD-sensitive device transport.

Custom JEDEC IC tray with high-precision cavities for complex IC modules. Features excellent anti-static performance (1.0×10⁴-1.0×10¹¹ Ω), MPPO material, and 490 cavities per tray. Fully customizable per chip design. Ideal for SiP, MEMS, and fine pitch IC packaging.

High-temperature JEDEC tray with ESD protection (1E4-1E11 Ω) and heat resistance up to 150°C. Made from premium PEI material, it ensures low warpage and dimensional stability for automated handling. Compatible with ASM/Advantest/YAMAHA machines. Free custom design with 24-hour turnaround. Ideal for AI chips, BGA, and IC packaging.

Engineered with electrostatic dissipative polymer, this JEDEC tray protects ICs from static and shock. Stackable, reusable, and automation-compatible. RoHS and ISO certified. Supports OEM/ODM customization for semiconductor handling and storage.

ESD-safe JEDEC tray for IC handling and storage. Made from durable MPPO with anti-static properties. Supports automated systems, stable stacking, and OEM/ODM customization. Ideal for semiconductor manufacturing and cleanroom environments.

Injection-molded MPPO ESD tray with resistance 1.0x10⁴-1.0x10¹¹ Ω. Ensures dimensional accuracy and secure pocket retention for sensitive devices. Supports OEM/ODM, stackable, and designed for automated semiconductor workflows.

This reusable JEDEC matrix tray offers high mechanical strength and ESD protection for semiconductor devices. Precision pocket layout ensures alignment in automated systems. Cleanroom-compatible, anti-static, and stackable. Supports OEM/ODM customization. Ideal for IC testing, assembly, and logistics.

ESD-safe JEDEC matrix tray with precision-molded pockets for secure IC positioning. Durable MPPO construction, stackable design, and 250 cavities. JEDEC compliant, supports OEM/ODM. Ideal for automated pick-and-place and semiconductor storage.

Durable JEDEC IC trays for safe storage and transport of integrated circuits. Features surface resistance 1.0x10e4-1.0x10e11Ω, flatness

Designed for safe storage and transport of BGA, QFP, QFN, LGA, and PGA ICs. Withstands up to 150°C, flatness

Standard JEDEC tray with 60 cavities, 24x14x6.3mm each, made of conductive PPE. Flatness ≤0.76mm, surface resistance 1.0x10e4-1.0x10e11Ω. ROHS certified. Protects chips from ESD and damage during transport. Accept OEM/ODM customization.

JEDEC-standard black PPE tray for high-precision IC storage. ESD stackable, moisture-proof, and reusable. Flatness