JEDEC IC Trays

Automation-ready JEDEC tray with custom cavity design for IC packaging and shipping. Features permanent ESD protection, accurate part alignment, and stable stacking. Durable MPPO material with RoHS certification. Accept OEM/ODM customization for pocket profile, color, and embedded identifiers.

Precision-molded JEDEC matrix tray with permanent ESD protection for ICs. Features 84 cavities (8.6x8.6x2.6mm), automation-ready design, and stable stacking. Customizable pocket depth and width. RoHS certified. Ideal for SMT, test, and storage.

This JEDEC matrix tray ensures secure semiconductor handling with permanent ESD protection and accurate part alignment. Compatible with automation systems, it features a robust MPPO build, RoHS certification, and customizable pocket profiles for IC assembly, inspection, and storage.

JEDEC-standard matrix tray for IC components. ESD-safe MPPO material ensures static protection. Precision pockets with 0.76mm max warpage for consistent pick-and-place. Stackable, automation-compatible, RoHS certified. Accept OEM/ODM customization.

JEDEC-standard matrix tray for secure BGA, PGA, QFP handling. Features precision pockets, ESD-safe PPE material, and automation-ready design. Supports OEM/ODM customization. RoHS compliant. Ideal for high-throughput assembly and testing.

ESD-safe JEDEC matrix tray for secure handling of BGA, PGA, QFP components. Precision pockets ensure exact positioning, while conductive material prevents static damage. Automation-compatible with stacking interlocks. Custom cavity sizes and OEM/ODM available. RoHS certified.

This JEDEC-compliant matrix tray ensures safe ESD-protected handling for IC components. Features precision-molded pockets, automation-ready design, and stack-safe interlocking. Made from conductive MPPO material with RoHS certification. Accepts OEM/ODM customization for pocket structure, color, and markings.

ESD-safe JEDEC matrix tray with 72 cavities for secure IC handling. Features precision pockets, automation-ready design, and stack-safe interlocking. RoHS certified. Custom pocket sizes and colors available for OEM needs.

ESD-safe JEDEC tray with precision-molded pockets for secure IC handling. Features 84 cavities, 0.76mm flatness, and automation-ready design. RoHS certified. Customizable pocket size, color, and markings for OEM/ODM needs.

Durable stackable JEDEC IC trays for BGA, QFP, QFN, LGA, PGA. Lightweight 120-200g with surface resistance 1.0x10e4-1.0x10e11Ω. ISO 9001, SGS, ROHS certified. Custom sizes available for efficient IC packaging and storage.

JEDEC IC tray for MEMS devices, cavity size 11.93x16.5x4.34mm. Made of MPPO, PPE, ABS, PEI, or IDP. Stackable, ESD protection, 128 cavities. ISO 9001, SGS, ROHS certified. Custom options available.

These stackable JEDEC IC trays are made from durable materials like MPPO and ABS, with surface resistance of 1.0*10e4-1.0*10e11Ω. Lightweight at 120-200g, they are compatible with automation equipment and storage systems. Certified ISO 9001, SGS, ROHS with custom options available.

JEDEC standard tray for automated handling of electronic components. Anti-static, reusable, and high temperature resistant (MPPO 150°C). Customizable sizes and materials available. Ideal for semiconductor, optical, and mechanical parts.

Hiner-pack offers fully JEDEC compliant ESD SMT trays for turnover and shipping of BGA, QFP, QFN, TSSOP ICs. Custom molding, 100% original material, ISO certified. 13 years of expertise ensures durability and anti-static protection.

High-performance MPPO/PPE JEDEC chip tray for antistatic IC storage and transport. Features 180 cavities, high temperature resistance, and automation compatibility. Customizable sizes and materials available. Certified ROHS, ISO9001, and SGS.

Durable JEDEC tray for BGA, QFN, and IC modules. Features 21 cavities (3x7) with precise 11.3x13.3mm cavity size. Made from high-temp MPPO/PEI materials. ROHS certified. OEM/ODM accepted. Lightweight design reduces logistics loss.

Antistatic JEDEC tray protects sensitive components from static damage. Customizable cavity size 8.3x24.4x2.4mm, 81PCS matrix. Made of MPPO/PEI, stackable, dust-proof, and compliant with international environmental standards.

High precision anti-static ESD JEDEC tray for memory ICs and semiconductor chips. Made from durable MPPO material with 21 cavities (35.3x35.3mm each). Protects components from static, moisture, and damage during transport. Compatible with automated production lines. Custom options available.

JEDEC matrix tray with precise pocket alignment for secure IC transport. Features high-performance ESD protection, automation-ready design, and strong stackability. Customizable pocket size, color, and edge profiles for diverse handling needs.

Durable MPPO die carrier tray with ESD protection, temperature range -40°C to +180°C. 60 cavities (12x5) with 25.8x26.3mm spacing. Ideal for semiconductor storage and transport. Custom sizes available.