JEDEC IC Trays

Stackable BGA Black JEDEC IC Trays Conform To Automation Equipment Product Description: These rectangular trays are stackable, allowing you to save space and easily access your IC chips when needed. They are also lightweight, with a weight range of 120~200g, making them easy to handle and transport. The JEDEC IC Trays are made from durable materials that can withstand frequent use and handling. They are an ideal solution for storing IC chips in a safe and organized manner,

Environmentally Friendly And ReusabAnti-Static Electronics Tray JEDEC Standard Component CQFP64G High Temperature Resistant MPPO 150°c Wireless Electronic Components Turnover Transportation IC ESD Trays JEDEC trays are reliable, continually proven and operated to handle and process parts in an automated environment. They have evolved and matured from their beginnings in the semiconductor industry and are used for other types of electronic components, optical and photonic

Turnover And Shipping BGA QFP QFN TSSOP Packaged IC TRAY Fully Compliant With JEDEC Standards And Equipment Manufacturer Factory Direct Sale Full Scales ESD SMT Tray Electronic Packaging Tray 100% Original Injection Customized Moulding Why choose Hiner-pack to design and produce ESD SMT electronic packaging trays for you? 1. Choosing the right supplier Hiner-pack is a company specializing in electronic packaging and tray manufacturing, with 13 years of experience in the

ESD ROHS Black Antistatic PPE MPPO IC Storage Packaging JEDEC Chip Tray ESD High Temperature IC Chip Tray Electronic Component Tray JEDEC standard injection molded trays are mainly used for anti-static IC storage, especially in the transportation and storage of PCB electronic components. These trays have the following features and advantages: 1. Application of high-performance materials New material development: more and more high-performance materials (such as PE1, PES, etc.

Reflow Testing Available JEDEC IC Tray Standard With BGA11.3*13.3mm High Temperature Tray Optimize handling for QFN, BGA, and custom modules with JEDEC trays built precisely to your product specs. Application: 1. Electronics Manufacturing: Widely used in semiconductor manufacturing, assembly, and testing. 2. R&D: Storing and testing new products in laboratories and R&D environments. 3. Logistics: Used in supply chain management to securely transport electronic components.

ESD Black Chip Die BGA QFN Packaging Tray For Optoelectronic Devices Tray Antistatic electronic JEDEC trays are special plastic packaging materials that can effectively prevent the generation of static electricity and thus protect electronic products from static damage. JEDEC trays are also a common plastic packaging material used for packaging, transporting and displaying a variety of products, such as IC manufacturing, electronic parts, D-RAM, precision instruments, etc.

High Precision Anti-Static ESD Memory Integrated Circuit JEDEC Ic Chip STM Tray Anti-Static MPPO Standard Matrix Tray For PCB Modules Electronic Components The advantage of JEDEC tray packaging is that it can protect the products from damage and contamination during transportation and storage.TRAY trays can effectively isolate and protect the products from friction and collision, and at the same time, it can also prevent the products from being affected by moisture, dust and

Temperature Resistance Hard ESD Tray For PCB Reusable Anti Static 7.62mm IC Chip Tray Each JEDEC tray we deliver can be custom-fitted to your IC's footprint—ensuring secure, ESD-safe transport. Designed for high-reliability electronics manufacturing environments, this JEDEC matrix tray combines precise component positioning with exceptional durability and static protection. Its uniform pocket structure ensures consistent alignment of parts throughout pick-and-place,

Product Description: These IC Die Carriers are made from high-quality MPPO material that ensures long-lasting durability even under extreme conditions. These Die Transfer Trays have a temperature range of -40°C to +180°C, making them ideal for use in a variety of environments. Whether you need to store your IC dies in a freezer or transport them in a hot environment, these trays can handle it all. The overall size of these Die Transfer Trays is 322.6x135.9x7.62mm, providing

Product Description: JEDEC matrix trays have standard dimensions of 12.7 x 5.35 inches (322.6 x 136mm). It's suitable for 90% of standard components including BGA, CSP, QFP, TQFP, QFN, TSOP and SOIC. Moreover, low profile trays are specially designed with a thickness of 0.25-inch (6.35mm), which can neatly accommodate these components. Features: Standardization JEDEC IC matrix trays are the industry standard in semiconductor manufacturing, with decades of history and usage

BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC Packaging Looking for a durable, heat-resistant tray for IC packaging? This JEDEC tray combines quality materials with exacting standards. JEDEC matrix trays measure 12.7 x 5.35 inches (322.6 x 136 mm) in width and length, respectively. These trays have a low-profile thickness of 0.25-inch (6.35mm). This design is suitable for storing and transporting 90% of all standard components, such as BGA, CSP,

Product Description: JEDEC matrix trays all have the same basic measurements: 12.7 inches wide by 5.35 inches long (322.6 x 136mm). Low profile trays, which have a thickness of 0.25 inches (6.35mm), can contain up to 90% of all the standard components such as BGA, CSP, QFP, TQFP, QFN, TSOP, and SOIC. Features: Standardization – Being compatible with most semiconductor manufacturing equipment, JEDEC IC matrix trays have decades of history and familiarity with support products

Product Description: Standard components such as < code >BGA< /code >, < code >CSP< /code >, < code >QFP< /code >, < code >TQFP< /code >, < code >QFN< /code >, < code >TSOP< /code > and < code >SOIC< /code >, are usually packaged within JEDEC matrix trays. The outline dimensions of all these trays are 12.7x5.35 inches (322.6 x 136mm). And, they are available in two types, with either 0.250-inch (6.35mm) thick, or

Product Description: Outlining all JEDEC matrix trays dimensions, twelve point seven by five point thirty five inches (322.6 x 136mm) is a standard measure. Furthermore, component pieces such as BGA, CSP, QFP, TQFP, QFN, TSOP, and SOIC are able to fit in low profile trays with a thickness of 0.25-inch (6.35mm). This thickness is adequate for ninety percent of the standard sizes. Features: Standardization JEDEC IC matrix trays provide compatibility with most semiconductor

Product Description: JEDEC matrix trays feature consistent outline dimensions of 12.7 x 5.35 inches (322.6 x 136 mm). Low profile trays with a thickness of only 0.25 inches (6.35 mm) are suitable for the majority of standard components like BGA, CSP, QFP, TQFP, QFN, TSOP, and SOIC. Features: Standardization – JEDEC IC matrix trays offer compatibility with most semiconductor manufacturing equipment. With decades of history and familiarity, support products for JEDEC matrix

Product Description: JEDEC matrix trays generally have the same measurements, which are 12.7 x 5.35 inches (322.6 x 136mm). The thickness of the low profile trays ranges from 0.25-inch (6.35mm). This size can easily fit most standard component, such as BGA, CSP, QFP, TQFP, QFN, TSOP and SOIC. Features: Standardization – JEDEC IC matrix trays offer compatibility with most semiconductor manufacturing equipment. With decades of history and familiarity, support products for JEDEC

Product Description: JEDEC matrix trays come in a uniform size; measuring 12.7 x 5.35 inches (322.6 x 136mm). In addition, they feature a low profile design which consists of a 0.25-inch (6.35mm) thick material. This design is suited to held the majority of electronic components, including BGA, CSP, QFP, TQFP, QFN, TSOP and SOIC. These trays are ideal for electronic manufacturing production and testing process, as their universal dimensions allow them to fit into most

QFP JEDEC IC Trays With Rectangular Shape And Strong Versatility Protect your chips during transit and storage with custom cavity JEDEC trays designed for your exact product form factor. The JEDEC matrix trays are all of the same size: 12.7 x 5.35 inches (322.6 x 136mm). They are considered low-profile trays, having a thickness of 0.25-inch (6.35mm). These trays can hold the majority of standard components, including but not limited to: BGA, CSP, QFP, TQFP, QFN, TSOP, and

Universal JEDEC Matrix Tray Stackable For IC Packaging Industry Offering both standard and custom configurations, our JEDEC trays meet a wide range of semiconductor packaging needs. This JEDEC matrix tray is crafted for precision and efficiency in electronics component handling, designed to meet the rigorous demands of high-speed, high-accuracy manufacturing environments. With a structure optimized for automated workflows, it supports reliable component presentation, safe

PPE Black ESD JEDEC Matrix Trays For Electronic Components ESD JEDEC Matrix Tray is the packaging tray used by the enterprise for Electronic components packaging test. The materials required for the tray are conductive, anti-static, high temperature resistance, high strength and other characteristics. Electronic components have high material requirements,so PPE plus carbon fiber reinforcement materials are generally selected. This can well meet the material performance