JEDEC IC Trays

JEDEC IC Trays Protect Semiconductor Devices For Packaging And Handling Operations Deliver outstanding heat resistance up to 150℃, built from robust Mppo raw material. Block static discharge and outside impurities. Keep stable physical performance under continuous high‑temperature workshop conditions, fit repeated circulation cycles. Offer flexible custom cavity solutions as core capability. Adjust cavity layout, cell size and outer outline to match varied chip forms. Accept

Durable JEDEC IC Trays in Heat-Resistant MPPO for Stable Protection JEDEC IC Tray is built for semiconductor packaging, crafted from heat-resistant MPPO material to withstand high temperatures while maintaining long-lasting structural stability. Its rigid design shields delicate ICs from shocks, dust, and moisture during storage and transport. JEDEC IC Tray adapts to unique needs with fully customizable dimensions, cavity layouts, and branding options. Whether standard JEDEC

Durable JEDEC IC tray in black PPE material, sized 322.6x135.9mm. Offers effective dust prevention and rigid stability for clean wafer handling. Supports OEM/ODM customization of cavity dimensions. Ideal for semiconductor packaging, die sorting, and cleanroom workflows.

High-precision JEDEC tray with V-groove cavities, anti-static and ESD-safe MPPO material. Minimizes particle contamination and chip damage. Ideal for fine-pitch ICs, BGA, and CSP packages. Custom pocket options available. Supports OEM/ODM.

Durable JEDEC IC tray made of MPPO for dust-free semiconductor wafer packaging. Offers stable protection, 161 cavities, and resistance 1.0×10⁴–1.0×10¹¹ Ω. Supports OEM/ODM customization for automated production lines.

Durable JEDEC IC tray made of heat-resistant MPPO, withstands up to 150°C. Reduces dust and prevents IC shifting. Fully customizable cavity sizes and grid layouts. Meets JEDEC standards. Ideal for automated packaging, cleanrooms, and high-temperature processes. OEM/ODM accepted.

Heat‑Resistant PPE JEDEC IC Trays Offer Stable IC Protection In Handling And Transport Searching reliable protection for sensitive IC chips? Built from high‑grade PPE, withstand high‑temperature working conditions. Shield delicate semiconductor parts from scratch and contamination in daily operations. Match multiple chip specifications. Custom cavity solution stands as core offer. Adjust cavity size and layout to satisfy different semiconductor project needs. Fit whole

Durable JEDEC IC Trays Reduce Dust And Protect Components In Packaging And Assembly Durable JEDEC IC Tray keeps semiconductor components clean by reducing dust buildup during packaging and assembly. Sturdy build withstands frequent handling, shielding parts from scratches and impacts. Durable JEDEC IC Tray follows JEDEC standards, ensuring smooth integration with automated production lines. It lowers component damage rates, supporting consistent quality across manufacturing

Industrial Grade JEDEC IC Trays for Clean Production and Long Term Protection Industrial Grade JEDEC IC Tray is engineered for clean production environments, shielding components from dust and contamination during manufacturing. Robust structure preserves component integrity for extended storage and automated handling. Industrial Grade JEDEC IC Tray adheres to JEDEC standards, ensuring seamless integration into high-precision production lines. It minimizes component damage

Durable JEDEC IC tray reduces dust contamination in wafer packaging. Made of MPPO with 1.0×10⁴-1.0×10¹¹ Ω resistance. Custom cavity layouts available. Compliant with cleanroom standards for automated production lines.

JEDEC IC Trays Reduce Dust And Protect Delicate Semiconductor Wafers During Packaging Constructed from high‑grade PPE raw material, sustain maximum 150℃ working temperature. Deliver stable anti‑static performance, keep away dust particles that damage sensitive chips. Stand repeated stacking and circulation inside semiconductor manufacturing workshops. Focus on flexible cavity customization as core strength. Adjust slot shape, inner dimension and overall tray outline. Match

JEDEC IC Trays for Dust Reduction and Durable Protection in Semiconductor Packaging JEDEC IC Tray is engineered to minimize dust contamination, keeping semiconductor components clean throughout packaging processes. Sturdy structure ensures reliable protection against impacts and scratches during handling. JEDEC IC Tray meets strict JEDEC standards, guaranteeing compatibility with automated production lines. It maintains component integrity, reducing waste and supporting

Durable JEDEC IC Trays Shield Components From Dust And Damage In Packaging And Shipping Durable JEDEC IC Tray keeps semiconductor components safe from dust and physical harm during packaging and shipping. Sturdy build withstands impacts and scratches, preserving component integrity from production to delivery. Durable JEDEC IC Tray meets strict JEDEC standards, ensuring seamless compatibility with automated packaging lines. It reduces component failure rates, supporting

JEDEC-compliant IC tray with 684 cavities (5.35x4.55mm each) for secure handling of micro components. Durable MPPO material, RoHS certified, flatness ≤0.76mm. Custom sizes, colors, and OEM/ODM available. Ideal for semiconductor and SMT factories.

Durable stackable JEDEC IC trays for BGA, QFP, QFN, LGA, PGA. Lightweight 120-200g with surface resistance 1.0x10e4-1.0x10e11Ω. ISO 9001, SGS, ROHS certified. Custom sizes available for efficient IC packaging and storage.

These stackable JEDEC IC trays are made from durable materials like MPPO and ABS, with surface resistance of 1.0*10e4-1.0*10e11Ω. Lightweight at 120-200g, they are compatible with automation equipment and storage systems. Certified ISO 9001, SGS, ROHS with custom options available.

Durable JEDEC tray for BGA, QFN, and IC modules. Features 21 cavities (3x7) with precise 11.3x13.3mm cavity size. Made from high-temp MPPO/PEI materials. ROHS certified. OEM/ODM accepted. Lightweight design reduces logistics loss.

Antistatic JEDEC tray protects sensitive components from static damage. Customizable cavity size 8.3x24.4x2.4mm, 81PCS matrix. Made of MPPO/PEI, stackable, dust-proof, and compliant with international environmental standards.

Standard JEDEC matrix trays for BGA, CSP, QFP, and more. Made from ESD-safe engineering plastic with 322.6x135.9mm dimensions. Stackable design ensures protection during transport and storage. ISO 9001 SGS ROHS certified. Custom sizes and colors available.

JEDEC standard matrix tray for IC packaging, testing, and SMT lines. Features anti-static, heat-resistant PC material with 84 cavities per tray. RoHS certified, flatness ≤0.76mm, and supports OEM/ODM customization.