Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
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Waffle Pack Chip Trays

China ESD Black 4 Inch Waffle Pack Tray 130 Cavities for Micro IC Chip Packaging for sale

ESD Black 4 Inch Waffle Pack Tray 130 Cavities for Micro IC Chip Packaging

Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days

Custom-engineered 4-inch ESD waffle pack tray with 130 cavities for secure micro IC chip handling. Made from PC material with surface resistance 1.0x10e4-1.0x10e11Ω. RoHS certified, OEM/ODM available. Reduces die shift and improves pick accuracy.

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