Waffle Pack Chip Trays

High-precision JEDEC tray for fine pitch ICs (≤0.5mm). ESD-safe, reusable, and automation-compatible. Custom pockets available. Durable ABS with 66-cavity capacity. Ideal for BGA, QFN handling.

High-precision JEDEC tray for fine pitch ICs (≤0.5mm). ESD-safe, reusable, and automation-compatible. Custom pockets available. Durable ABS with 66-cavity capacity. Ideal for BGA, QFN handling.

Industrial-grade waffle trays securely hold fine pitch ICs, preventing shifting and damage. Durable material withstands frequent use. Customizable grid size and cavity depth. ESD safe with 1.0×10⁴-1.0×10¹¹ Ω resistance. Ideal for automated lines and cleanrooms.

Industrial-grade waffle trays securely hold fine pitch ICs with precise grid structure, preventing shifting and damage. Durable, anti-static material with 1.0×10⁴-1.0×10¹¹ Ω resistance. Fully customizable cavity sizes and layouts. Ideal for automated production lines and cleanroom environments.

Durable grid waffle trays with uniform cavity design securely hold fine pitch ICs. Features 1.0×10⁴-1.0×10¹¹ Ω resistance, MAX 0.26mm warpage, and cleanroom-grade protection. Accept OEM/ODM custom cavity sizes. Ideal for semiconductor storage, transfer, and automated production.

Durable anti-static waffle pack tray with precise 16x16 cavity matrix for fine pitch ICs. Resistance 1.0×10⁴–1.0×10¹¹ Ω ensures ESD protection. Supports full customization of cavity size and layout. Seamlessly integrates with automated pick-and-place systems for reliable semiconductor handling.

Precision waffle tray with 408 cavities securely holds IC chips, preventing movement and ESD damage. Made from durable anti-static material (1.0×10⁴-1.0×10¹¹ Ω). ISO certified, RoHS compliant. Supports OEM/ODM with custom cavity sizes for automated production lines.

Professional ESD waffle trays with anti-static and dust-proof design for fine pitch ICs. Precision waffle structure ensures stable holding and contamination control. Resistance 1.0x10⁴-1.0x10¹¹ Ω. Fully customizable cavity sizes. Ideal for automated production lines and cleanroom environments.

ESD-safe waffle trays with 10⁴-10¹¹ Ω resistance securely cradle delicate IC chips. Customizable cavity sizes and layouts. ISO certified, RoHS compliant. Ideal for automated lines, cleanrooms, and global shipping.

Reliable ESD protection for IC chips with 125℃ heat resistance and customizable cavity sizes. Cross-slot design secures components during testing, storage, and logistics. ISO certified and RoHS compliant for cleanroom and automated production.

ESD safe waffle tray with 125°C heat resistance and cross-slot design for secure IC chip handling. Custom cavity sizes available. ISO and RoHS certified. Ideal for semiconductor packaging, testing, and cleanroom use.

ESD waffle tray with 10⁴-10¹¹Ω resistance and 125℃ heat tolerance. Precision cross cavities protect fine pitch ICs. Fully customizable cavity size and layout. ISO and RoHS certified. Ideal for semiconductor packaging, testing, and transport.

JEDEC compliant waffle pack tray with 100 dense cavities for fine pitch ICs. Provides stable ESD anti-static and cleanroom-grade contamination control. Supports fully customized cavity sizes. ISO certified and RoHS compliant for reliable semiconductor handling.

JEDEC standard waffle pack tray with 10x20 grid cavities for ultra-fine pitch ICs. Provides effective contamination control, static protection, and scratch resistance. Supports OEM/ODM custom cavity sizes. Durable stackable design for semiconductor packaging, testing, and logistics.

JEDEC standard waffle pack trays with precise grid cavities for contamination control. Features 1.0x10⁴-1.0x10¹¹ Ω static resistance, stackable design, and RoHS/ISO certification. Custom cavity sizes and OEM/ODM available for fine pitch ICs.

JEDEC-standard waffle pack tray with 216 cavities for contamination-free IC handling. MPPO material offers ESD protection (1.0×10⁴–10¹¹ Ω). Supports OEM/ODM custom cavities. ISO & RoHS certified. Ideal for QFN/BGA/CGP packaging, testing, and logistics.

High-precision cleanroom waffle pack trays with anti-static dust-proof design for delicate fine pitch ICs. Features dense grid cavity structure, ISO certified, RoHS compliant. Supports fully customized cavity sizes and layouts. Ideal for semiconductor packaging, inspection, and transportation.

Anti-static waffle trays with 171 cavities (3.00x0.70x0.30mm) for safe fine pitch IC handling. ISO certified, RoHS compliant, and customizable. Ideal for semiconductor manufacturing, testing, and cleanroom logistics.

Lightweight 4-inch Waffle Pack Tray Lightweight 4-inch waffle pack tray designed for quick and easy manual handling while maintaining ESD protection. Key Features/ Benefits Lightweight design ESD safe Easy handling Broad package compatibility Specifications Brand Hiner-pack Model HN25176 Material Electrostatic dissipative plastic Compatibility Class 1000 / ISO 5 environments Color Black Surface Resistivity 1.0×10⁴ - 1.0×10¹¹ Ω Outline Line Size 101.6x101.6x5.5 mm Pocket Size

Cleanroom Compatible 4-inch Waffle Pack Tray This cleanroom-rated waffle pack tray meets stringent contamination control requirements while offering ESD protection and dimensional accuracy needed for sensitive ICs in sterile settings. Key Features/ Benefits Cleanroom compatible ESD safe Ultra-low particulate design Consistent pocket integrity Specifications Brand Hiner-pack Model HN25170 Material Cleanroom polymer Compatibility Class 1000 / ISO 5 environments Color Black