Waffle Pack Chip Trays
ESD ABS Waffle Pack Chip Tray 250PCS 2x2 Inch Regular Cavities for IC Components
Durable ESD ABS injection molded tray with 250 regular cavities for safe chip loading, storage, and transport. Features surface resistance 1.0x10e4-1.0x10e11Ω, flatness max 0.2mm, and customizable sizes. RoHS certified, stackable, and cost-effective for Pick and Place machines.
4 Inch Waffle Pack Chip Trays with 63 Pockets 6.62×8.29×0.8mm ESD Anti-Static Protection for Electronic Components
Customizable 4-inch waffle pack chip trays with 63 pockets measuring 6.62×8.29×0.8mm. Features ESD stable anti-static protection, high-temperature resistance, and ROHS/SGS certification. Ideal for wafer dies, PCBA modules, and electronic component packaging with stackable, reusable design for cost-effective automation.
4 Inch ESD Waffle Pack Trays with Tunneling Shape - 320 Cavity Capacity, 0.3mm Flatness for IC Components
Special tunneling shape waffle pack trays with 4-inch ESD material provide superior protection for IC components, semiconductors, and micro systems. Features 320 cavity capacity, maximum 0.3mm flatness, and surface resistance of 10⁴-10¹¹ Ω. OEM/ODM services available with ROHS certification and automated handling for components as small as 0.0005 inches.
Heat Resistant Waffle Pack Chip Tray 101.4x101.4x5.5mm 70 Cavities MPPO
Lightweight, heat and corrosion resistant waffle pack tray for precision electronic components. Features 70 cavities, permanent anti-static properties, and edge chamfer design. Custom sizes and OEM accepted. ROHS certified.
Anti Static Waffle Box Chip Tray PC Material 4 Inch 30 Cavities for IC Packaging
Professional PC waffle tray with anti-static properties, 101.6x101.6x4.5mm, 30 cavities. Resists bending and aging, supports 120-220°C baking. Custom sizes available. ROHS and SGS certified. Ideal for semiconductor chip packaging and storage.
Customizable ESD Waffle Pack Chip Tray 2 Inch 20 Cavity for IC RF VR Chips
ESD waffle pack with 10E04-10E11Ω surface resistance protects chips during transport. Customizable size, color, and cavity design. RoHS/SGS certified. Operating temperature -40 to 220°C. OEM/ODM service available.
PC Material Waffle Pack Chip Tray HN21131 50x50x4.5mm for LED Chips Packaging
Hiner-pack HN21131 waffle pack tray made of PC material with ESD protection, 254 cavities in 18x15-16 matrix. Lightweight, stackable, and compatible with 2-4 inch feeders. Supports OEM/ODM, ROHS certified, ideal for semiconductor and LED chip packaging.
Standard Square Matrix Waffle Pack Chip Tray 50.72mm PC Black 12 Cavities
Durable PC chip tray with 3x4 matrix pockets for safe storage and transport of electronic components. Features electrostatic protection, chamfered corner for orientation, and stackable design. Custom sizes and materials available. ROHS and SGS certified.
Cleanroom Waffle Pack IC Trays 144 Cavities MPPO ESD Protection for Fine Pitch ICs
Professional cleanroom-grade waffle pack trays for contamination control. Features 144 cavities, MPPO material, ESD protection, and JEDEC grid. Ideal for QFN, BGA, CSP packaging. ISO certified, RoHS compliant, with OEM/ODM custom options.
Durable High-Temperature Resistant Reusable Waffle Pack Chip Trays for Fine Pitch IC Protection
High-precision JEDEC tray for fine pitch ICs (≤0.5mm). ESD-safe, reusable, and automation-compatible. Custom pockets available. Durable ABS with 66-cavity capacity. Ideal for BGA, QFN handling.
Cleanroom Grade Waffle Pack Chip Trays 63 PCS IC Handling Contamination Control
Meet strict cleanroom standards for safe handling of delicate fine pitch ICs. JEDEC structure with 1.0×10⁴ to 1.0×10¹¹ Ω resistance. ISO and RoHS certified. Custom cavity sizes and OEM/ODM available.
Heat-Resistant Anti-Static Waffle Pack Trays with Customizable Cavity Sizes for Semiconductor IC Chips
High-precision JEDEC tray for fine pitch ICs (≤0.5mm). ESD-safe, reusable, and automation-compatible. Custom pockets available. Durable ABS with 66-cavity capacity. Ideal for BGA, QFN handling.
High Temp ESD Waffle Trays 50.8x50.8mm for Semiconductor ICs
High temperature resistant ESD waffle trays with 1.0×10⁴-1.0×10¹¹ Ω resistance. Customizable cavity sizes securely fix delicate fine pitch ICs during high temp processing. ISO certified, RoHS compliant, OEM/ODM accepted.
Heavy Duty Waffle Pack Chip Trays with Uniform Grid for Fine Pitch IC Protection
High-precision JEDEC tray for fine pitch ICs (≤0.5mm). ESD-safe, reusable, and automation-compatible. Custom pockets available. Durable ABS with 66-cavity capacity. Ideal for BGA, QFN handling.
SGS 0.2mm Flatness PC Waffle Pack Chip Trays for Optical Device Packaging 4 Inch
High-precision waffle pack chip trays with 0.2mm flatness for optical device packaging. Made of PC with anti-static and high-temperature resistance. SGS certified, customizable sizes, and OEM/ODM service available. Ideal for semiconductor and SMT assembly.
Anti-Static Reusable Cleanroom-Grade Waffle Pack Chip Trays for Semiconductor IC Protection
High-precision JEDEC tray for fine pitch ICs (≤0.5mm). ESD-safe, reusable, and automation-compatible. Custom pockets available. Durable ABS with 66-cavity capacity. Ideal for BGA, QFN handling.
Reusable ESD-Safe Waffle Pack Chip Trays with Customizable Cavity Size for Semiconductor IC Protection
High-precision JEDEC tray for fine pitch ICs (≤0.5mm). ESD-safe, reusable, and automation-compatible. Custom pockets available. Durable ABS with 66-cavity capacity. Ideal for BGA, QFN handling.
Uniform-Grid Reusable Waffle Pack Chip Trays for Fine-Pitch IC Protection and Transit
High-precision JEDEC tray for fine pitch ICs (≤0.5mm). ESD-safe, reusable, and automation-compatible. Custom pockets available. Durable ABS with 66-cavity capacity. Ideal for BGA, QFN handling.
Reusable Waffle Pack Chip Trays with Uniform Grids for Fine-Pitch IC Protection
High-precision JEDEC tray for fine pitch ICs (≤0.5mm). ESD-safe, reusable, and automation-compatible. Custom pockets available. Durable ABS with 66-cavity capacity. Ideal for BGA, QFN handling.
Waffle Pack Chip Trays made from anti static materials to ensure safe handling and storage of delicate semiconductor IC chips
High-precision JEDEC tray for fine pitch ICs (≤0.5mm). ESD-safe, reusable, and automation-compatible. Custom pockets available. Durable ABS with 66-cavity capacity. Ideal for BGA, QFN handling.