Bare Die Trays

Professional bare die trays for microelectronic components featuring permanent antistatic protection (ESD/RoHS compliant), dust-free packaging for cleanrooms class 10-1000, and custom design capabilities. Available in 2-inch, 3-inch, and 4-inch sizes with materials including Antistatic/Conductive ABS and PC. Ideal for semiconductor, medical, and precision component applications.

Professional bare die trays with permanent antistatic properties, ESD/RoHS compliance, and high precision dimensions. Available in 2, 3, and 4 inch sizes with customizable materials including ABS and PC. Features dust-free packaging for cleanroom environments and automation compatibility for enhanced production efficiency.

Professional chip tray with permanent antistatic properties compliant with ESD/RoHS standards. Features 0.3mm warpage tolerance, 494 pocket capacity, and dust-free packaging for cleanroom environments. Custom sizes and designs available with rapid 3-week delivery for microelectronic component protection.

Injection molded bare die tray with 442 cavities, warpage under 0.3mm. Optional lid and clip for secure transport. ESD or non-ESD, custom logo available. Ideal for storage and packing of bare die components.

Precision injection-molded antistatic bare die tray for secure IC storage and handling. Features crush-resistant durability, heat resistance, and customizable cavity orientation. Warpage under 0.3mm ensures reliable protection during transport and high-temperature processing.

Durable black bare die tray with anti-static protection and flatness

Durable bare die tray with 110 cavities, max 0.3mm flatness, and heat resistance. Ideal for semiconductor transport and storage. Custom sizes available. ISO 9001, ROHS, SGS certified. Protects chips from dust and static.

Permanent antistatic, dust-resistant, and durable bare die tray for semiconductor packaging. Injection molded with precise cavity dimensions, stackable design, and ROHS certification. Accepts OEM/ODM customization for chip transport and storage.

Permanently antistatic, dustproof, and wear-resistant bare die tray with flatness

Molded from ESD-safe carbon-fiber reinforced polymers, these chip trays offer durable, reusable storage for dies and optoelectronic components. With high temperature resistance up to 180°C and customizable pocket sizes, they ensure safety and efficiency in cleanroom environments.

Molded from ESD-safe, carbon-powder-free polymers with carbon-fiber reinforcement for strength and permanent protection. Supports up to 180°C bake temperature. Industry-standard 2" and 4" sizes with customizable pocket geometry. Durable, reusable, and eco-friendly.

Molded from ESD-safe, carbon-fiber-reinforced polymers, this ABS bare die tray offers durable, reusable protection for chips and dies. Withstands up to 180°C bake temperature. Available in 2-inch and 4-inch industry-standard formats, with customizable pocket sizes and optional lid/clip accessories.

Precision-molded conductive ABS tray for secure storage and handling of semiconductor bare dies and CSPs. Features a compact 2x2 inch footprint with 12 customizable pockets. Provides ESD protection, dimensional stability, and compatibility with automated processes. Ideal for inspection, sorting, and packaging.

This precision-molded 2x2 inch waffle tray offers 162 pockets for safe microchip storage. Made of conductive ABS polymer, it provides reliable ESD protection and resists warping. Customizable pocket shapes and heat-resistant versions available for thermal testing. Ideal for bare die and CSP handling.

Precision-molded conductive ABS tray for safe storage and transport of semiconductor die and CSP. 2x2 inch footprint with 88 pockets, 0.2mm warpage tolerance, and ESD protection. Customizable pocket shapes, stackable design, and heat-resistant options available for automated workflows.

Crafted from ESD-safe carbon fiber reinforced polymers, these waffle pack trays withstand 180°C bake temperatures. Available in 2-inch and 4-inch sizes with customizable pocket geometry. Durable, reusable, and ideal for secure chip module handling.

ESD-safe PC waffle pack tray for transport of bare dies and microelectronic components. Durable, reusable, and heat-resistant up to 180°C. Available in 2-inch and 4-inch sizes with customizable pocket geometry. Optional lid and clip included.

ESD-safe ABS die carriers for precise placement and stackable storage. Temperature range friendly, 100% clean room certified. Customizable pocket sizes and bakeable materials. Durable, reusable, and biodegradable for semiconductor transport and testing.

Durable ABS bare die trays with 160 pockets for safe transport and handling. ESD safe, clean room certified, and temperature resistant. Customizable sizes and pocket geometry available. Ideal for semiconductor die assembly and testing.

Durable 2-inch waffle pack chip tray with ESD protection for safe handling and transport of bare die and CSP. Features 80 cells, ABS material, clean room certified, reusable, and customizable size and pocket geometry.