Stamping Heat Sink

Copper Fin Heat Sink Material: copper 1100; Surface finish:copper wash; Process:soldering; Certification: Rohs. Product Introduction Product overview As copper owns a tremendous thermal conductivity, the thermal transfer effeciency is almost double than aluminum, so copper fin heat sink is a brilliant option for high density power applications which generate the high flux heat. Copper can absorb the heat from electronic components and spread it fast to the copper fin and

Folded Fin Heat Sink Aluminum Material: AL1050; Surface finish:nickel plating; Dimension:customized; Package:Standard packing. Product Introduction Product information Material AL1050 or Cu1100 Size Customized Surface finish nickel plating, passivation Certification ISO9000, RoHS MOQ No MOQ limited Application High power electronics, Motor drives, Telecoms Package type Tray, carton, wooen box Product benefits The aluminum folded fin heat sink has lightweight properties; This

Copper Folded Fin Heat Sink Material:CU1100; Surface finish: Passivation,copper wash; Process: Stamping, soldering, Package: Tray, carton, wooden box. Product Introduction Product specification Material: Copper 1100; Certification: ISO9000, RoHS; Surface finish: Copper wash, Passivation; 24 inch(609mm)maximum profile width; The thickness of fin can be 0.2mm; The fin desity can be from 4 fins to 38 fins per inch; The height can be from 0.02 inch to 2.75 inch; The airflow

Bonded Fin Heat Sink Material: AL6061; Surface finish: Anodizing, nickel plated; Application: IGBT; Package: Carton, wooden box. Product Introduction Product details Bonded fin heat sink is a heat sink type of fins bonded into a base which has a lot of grooves to match the fins. This kind of heat sink allows for higher fin densities and fin aspect ratio than the extruded heat sinks. which can significantly improve the thermal performance than heat sink extrusions due to the

Bonded Fin Heat Sink Manufacturer Material: AL6061,6063; Certification: RoHS, ISO9000, ISO9001; Surface finish: Anodizing, nickel plated; Location: China. Product Introduction Product specification Material AL6061,6063, Deep process CNC milling/saw cutting/drilling/tapping/laser marking Production porcess Profile extrusion, cutting, CNC machining, deburring, cleaning, inspection, packing Size Customized Surface treatment Milling finish/Degreasing/Anodizing/Electrophoretic

Copper Heat Sink Fins Product Description: Compared with traditional heatsink, micro stamping sink has smaller size, simpler structure for lower performance required. Usually, it contains a stamping base thinner than 5mm , zipper fin, or folder fin, and copper pipe for performance improve. Metal or plastic hardware... Product Introduction Product introduction As copper has a extraordinary thermal conductivity, it can absorb the heat much faster than aluminum, copper fins can

Custom Aluminum Finned Heat Sink Material: Aluminum alloy 1100; Process: Stamping,skiving; Surface finish: nickel plating; Application: LED,Server,CPU,GPU. Product Introduction Product introduction Fin is a vital part of heat sink as it can increase the surface area to improve the heat dissipation, aluminum has a tremendous heat dissipation ability, so it's the main material to manufacture the heat sink fins, aluminum finned heat sinks have several patterns including aluminum

Aluminum Zipper Fin Soldering Heat Sink Type: Soldering heat sink; Material: aluminum zipper fins, aluminum base, heat pipes; Process: Soldering. Product Introduction Product Description: Zipper fin heat sink is a perfect air cooling option for high power applications, a completed zipper fin stack is zipped together by a lot of metal sheets which are stamped. The fins shape, length, and height can be achieved by a custom tooling, the fins can be closed or open which are based

Aluminum Folded Fin Soldering Heat Sink Type: Folded fin soldering heat sink; Process:Soldering; Components: Aluminum folded fins,aluminum base,heat pipes; Application: High power applications. Product Introduction Aluminum folded fin soldering heat sink is designed to soldering the aluminum folded fins with aluminum base, and heat pipes if necessary to improve the thermal performance. In thermal management, folded fins allows for increasing the surface area at a given space,

Stamping Zipper Fin Cooling Heatsink Product Introduction Product Description: Compared with traditional heatsink, micro stamping sink has smaller size, simpler structure for lower performance required. Usually, it contains a stamping base thinner than 5mm , zipper fin, or folder fin, and copper pipe for performance improve. Metal or plastic hardware are used mostly, we provide thermal grease of SHIN-ETSU and Dow Corning series materials , Laird , 3M Honeywell, Fujipoly PAD