Thermal Insulation Materials
TIS100-10 Silicone Thermally Conductive Insulator 1.0 W/mK with 0.25mm to 4.0mm Thickness for Communication Equipment
High-performance silicone thermal insulator featuring 1.0 W/mK thermal conductivity and >10,000 Vac dielectric strength. Available in 0.25mm, 2.0mm, and 4.0mm thicknesses with UL94 V0 flame rating. Ideal for power semiconductors, automotive batteries, and communication equipment with custom die-cut options available.
TIS100-05 Thermally Conductive Insulator Pad 1.0 W/mK Thermal Conductivity 0.23mm-0.45mm Thickness
High-performance thermally conductive insulator pad with 1.0 W/mK thermal conductivity and >3500 VAC dielectric strength. Features ceramic-filled silicone construction, fiberglass reinforcement, and operating range of -45°C to 180°C. Custom sizes and adhesive options available for automotive, power supply, and semiconductor applications.
TIS100-03 Thermal Insulation Material 0.15-0.5mm Thickness with 1.0W/mk Conductivity and 3500VAC Dielectric Strength
High-performance thermal insulation materials featuring 1.0W/mk thermal conductivity and 3500VAC dielectric strength. Available in thicknesses from 0.15mm to 0.50mm with UL94 V0 flame rating. Ideal for automotive batteries, power semiconductors, and motor controllers with custom die-cut options available.
TIS100-02 Thermal Insulation Material with 1.0 W/mK Conductivity and 0.23-0.45mm Thickness Options
High-performance thermal insulation material featuring 1.0 W/mK thermal conductivity and >3500 VAC dielectric strength. Available in 0.23mm, 0.3mm, and 0.45mm thicknesses with pressure-sensitive adhesive options. Ideal for automotive batteries, power semiconductors, and motor controllers with UL94 V0 flame rating.
TIS100-01 Thermal Insulation Material 1.0W/mK Conductivity 0.15-0.45mm Thickness UL94V0 Rated
High-performance thermal insulation material with 1.0W/mK conductivity and 3500VAC dielectric strength. Features ceramic-filled silicone construction, -45°C to 180°C operating range, and UL94V0 flame rating. Ideal for power semiconductors, automotive electronics, and thermal management applications with custom die-cut options available.