Silicone Free Thermal Pad

Good Performance Non Silicone Thermal Gap Pad For Automotive Electronics The Z-Paster®100 6060-11series is a siloxane-free thermally conductive interface material applied to fll the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effectively

High-performance silicone-free thermal conductive gap filler with 3.0 W/mK thermal conductivity, designed specifically for charging pile thermal management. Features ROHS compliance, 65 Shore 00 hardness, and continuous operating temperature range of -20°C to 125°C. Ideal for automotive, medical, and electronic cooling applications requiring reliable heat dissipation.

High-performance silicone-free thermal conductive material with 3.0 W/mK thermal conductivity and thickness range from 0.5mm to 5.0mm. Ideal for graphics card thermal modules, automotive batteries, and medical devices. Features ROHS compliance, UL 94 V0 rating, and multiple international certifications for reliable thermal management solutions.

High-performance silicone-free thermal conductive material with 2.0W/mK thermal conductivity and 0.5-5.0mm thickness range. Features ROHS compliance, low thermal resistance, and excellent flexibility for graphics cards, power supplies, medical devices, and LED applications. Enhances heat dissipation efficiency and extends electronic component lifespan.

High-performance silicone-free thermal conductive gap filler with 2.0W/mK thermal conductivity and thickness range of 0.25mm to 5.0mm. Features ROHS compliance, excellent compressibility, and low thermal resistance for cooling electronic components to chassis frames. Ideal for automotive, medical, and LED applications requiring reliable heat transfer solutions.

High-performance non-silicone thermal gap filler pad with 2.0W/mK conductivity, designed for automotive batteries and power supplies. Features ROHS compliance, -20°C to 125°C operating range, and 94 V0 flame rating. Ideal for uneven surfaces and silicone-sensitive applications with thickness options from 0.25mm to 5.0mm.

High-performance silicone-free thermal interface pad with 1.5 W/mK conductivity and 0.25-5.0mm thickness range. Features ROHS compliance, low thermal resistance, and high compressibility for CPU, GPU, LED, and power supply thermal management applications. Manufactured in Vietnam with free samples available.