Thermal Pad

Thermal Gap Filler Designed To Improve Thermal Interface Between Heat Sinks And Heating Elements With Soft Elastic Pads Product descriptions TlF®100-32-05S Series is a well-balanced,general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of

Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W For Heat Management Product descriptions The TIF®100-60-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low stress fit. It is suitable for addressing lissues such as large tolerances, uneven

Thermal Gap Filler Silicone Thermal Pad With Thermal Conductive 6.0W For Heat Management Product descriptions The TIF®100-60-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low stress fit. It is suitable for addressing lissues such as large tolerances, uneven

CPU Thermal Pad Silicone Thermal Interface Material 5.0W RoHS Compliant For Cooling Of Automotive Electronics Product descriptions The TIF®100-50-11S use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Their flexibility and elasticity make them suited to the

Heat Transfer CPU Thermal Pad With 5.0W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment Product descriptions TlF®100-50-05E is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and

Ultra Low Volatility Of Siloxane Silicone Thermally Conductive Gap Filler Pads For Graphics Card Cooling Module Product descriptions The TIF®100L 2050-06 eries is a thermal pad with ultra-lowsiliconoxygen volatilization, designed specifically for optical and high-precision applications. Its soft and elastic material can fill the uneven gaps between heating elements and heat sinks or metal bases, limprove thermal conductivity efficiency,and effectively extend the life of

TIF®100-30-11US Thermal Conductivity 1.5W Thickness 0.5~5.0mm Silicone Thermal Pad Insulation Thermal Pad For Game Machine Product descriptions TlF®100-30-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating

2.0W Thermal Conductivity Silicon Pad Silicon Insulation Pads Cooling Gap Filler Silicone Pads For GPU CPU Products description TIF®100-20-10S Series is a well-balanced,general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

Silicone Thermal Pad Thermal Interface Material Gap Filler Pads Providing Heat Dissipation In Electronics Applications Products description TIF®100-30-10S Series is a well-balanced,general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic

Particularly Soft 1.5W/MK Thermal Gap Filler Pad For Computer CPU/GPU Cooling Product descriptions TIF®100-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is

TIF100-20-05U Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB /GPU/SSD Product descriptions TlFTM100-20-05U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even

TIF100-20-02U Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.5MM-5.0MM With Low Thermal Resistance Products description Ziitek TIF™100-20-02U series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF100-20-02U is an electrically isolating material, which allows its use in applications

TIF®100-20-02S High Thermal Conductive Pad For Automotive Silicon Thermal Pad Product descriptions TlF®100-20-02S is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductive 2.0W/mK > Moldability for complex

TIF100-19S Thermally Conductive Silicone Pads Black Thermal Pad For Heatsink Cooller Product descriptions TlFTM100-019S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which

TIF100-16-38UF silicone thermal gap filler pad offers 1.6W/mK thermal conductivity for efficient heat transfer in electronic applications. Features natural tackiness, RoHS compliance, UL recognition, and available in thicknesses from 0.5mm to 5.0mm. Ideal for CPUs, GPUs, motherboards, automotive electronics, and power supply cooling solutions.

TIF100-11S silicone thermal gap pad offers 1.5W/mK thermal conductivity for efficient heat transfer in electronic applications. Features natural tackiness, RoHS compliance, UL recognition, and operates from -40 to 160℃. Available in thicknesses from 0.5mm to 5.0mm with adhesive and reinforcement options.

High-performance silicone-based thermal interface pads with 1.0W/mK thermal conductivity and UL V-0 flame rating. These gap fillers reduce thermal resistance between heat sources and sinks, featuring RoHS compliance, electrical isolation, and durability for electronics cooling applications including CPUs, motherboards, and portable devices.

High Thermal Conductivity Heat Sink Thermal Pad Silicone Based Gap Filler Designed For Cooling Of AI Processors And AI Servers Product descriptions The TIF®100-30-06S Series is awell-balanced,general-purpose thermal pad.It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent suface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of

Exceptional Thermal Conductivity Rating Of 6.5W/M-K Silicone-Based Thermal Gap Pad Filler For AI Processors AI Servers Product descriptions The TIF®100-65-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit, It issuitable for addressing issues such

TIF100-30-06UF 1.5W/M.K Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad For Semiconductor Heat Dissipation Product descriptions Ziitek TlF®100-30-06UF thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductive 1.5W/mK >