Thermal Conductive Silicone Glue

TIS580-25 is a one-component, dealcoholized silicone adhesive with 2.5W/mK thermal conductivity and UL94 V-0 rating. Cures at room temperature in 3-7 days, operates from -60°C to 250°C, and provides excellent adhesion to metals without corrosion. Ideal for LED cooling, power modules, and electronic component bonding applications.

2.8W/MK High Thermal Conductive Two Component Potting Silicone Adhesive For High Voltage Package,Relay TIG®680-28AB Series is a two-component high thermal conductivity silicone sealant with room temperature curing, long working time, and flame retardant properties. This product is particularly suitable for sealing capacitors and small electronic devices. Its excellent flexibility properties enable it to provide excellent cushioning protection for coating materials. The low

TIG®680-40AB 4.0W/MK High Thermal Conductive Two Component Potting Silicone Adhesive For Electronic Industry Heat Dissipation TIG®680-40AB Series is a two-component high thermal conductivity silicone sealant with room temperature curing, long working time, and flame retardant properties. This product is particularly suitable for sealing capacitors and small electronic devices. Its excellent flexibility properties enable it to provide excellent cushioning protection for

Two-component silicone thermal conductive resin with 1.5W/mK thermal conductivity, UL94 V-0 fire resistance, and -40℃ to 160℃ operating range. Ideal for LED lighting, transformers, capacitors, and electronic device potting with excellent insulation and waterproof properties.

Two-component silicone potting adhesive with 1.2W/mK thermal conductivity and UL94 V-0 fire resistance. Features room temperature curing, 30-minute working time, and excellent thermal management for capacitors, transformers, LED drives, and electronic component protection. Operating temperature range: -40°C to 160°C.

One-component thermally conductive silicone adhesive with 1.3W/mK thermal conductivity and UL94 V-0 flame rating. Features dealcoholized formulation to prevent metal corrosion, excellent adhesion to various substrates, and wide operating temperature range from -60℃ to 250℃. Ideal for electronics cooling applications.

One-component room temperature cure silicone adhesive with 1.0W/mK thermal conductivity and UL94 V-0 flame retardancy. Features excellent adhesion to metals, low viscosity for void-free application, and operation temperature range of -60℃ to 250℃. Ideal replacement for thermal pastes and pads in electronic applications.

One-component room temperature cure silicone adhesive with 2.0W/mK thermal conductivity and UL94 V-0 flame retardancy. Features low shrinkage, excellent electrical insulation, and strong adhesion to metals. Ideal for electronics cooling applications including LED systems, power modules, and integrated circuits.

TIS580-12 is a dealcoholized single-component silicone adhesive with 1.2W/mK thermal conductivity and UL94 V-0 flame retardancy. This ready-to-use adhesive provides excellent electrical insulation, strong adhesion to metals, and operates from -60°C to 250°C. Ideal for replacing thermal paste in electronics, LED systems, and power modules with reliable gap-filling thermal conduction.

TIS580-12 is a one-component dealcoholized thermally conductive silicone adhesive with 1.2W/mK thermal conductivity and UL94 V-0 flame rating. This room-temperature curing adhesive provides excellent electrical insulation, strong adhesion to metals, and corrosion-free performance for electronics thermal management applications.