The SF201 is a single-sided adhesiveless flexible copper clad laminate developed by Rogers Corporation. As a polyimide flexible printed circuit material, SF201 offers excellent electrical and mechanical properties. It has a dielectric constant of 3.51 at 10 GHz and 23°C with a very low dissipation factor of 0.0059.

Some key benefits of SF201 include its high peel strength of 1.27 N/mm, water absorption rate of only 1.4%, and chemical resistance of over 90%. It also delivers over 5000 cycles of folding endurance for reliable flexibility. SF201 is halogen free and achieves a UL94 V-0 flame rating. It is compatible with the RoHS directive and free from harmful substances.

A typical FPC stackup using SF201 would be a 1-layer design with 35 μm of copper bonded to a 0.025 mm thick polyimide core. Example construction details for a 200x150mm board include 4/4 mil trace/spacing, 0.3mm holes, and finished thickness of 0.13mm with 1oz copper. Electrical testing is performed prior to shipment.

As seen from the sample statistics, this 17 component FPC design contains 23 total pads across 1 net. Typical applications that benefit from SF201's properties include computers, mobile phones, cameras, displays, automotive electronics and more. Artwork is supplied following IPC standards.

In summary, SF201 is a top-performing polyimide flexible substrate that enables reliable, high density and flexible circuit designs across various industries.