Shenzhen Bicheng Electronics Technology Co., Ltd
                                                                                                           
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Rogers RO3006 high frequency PCB 2-layer 10mil 1 oz (1.4 mils) outer layers with ENIG

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Product Description

Unveiling the Power and Versatility of Rogers RO3006 High-Frequency PCBs

 

Introduction: Revolutionizing High-Frequency PCB Technology with RO3006

In the realm of high-frequency printed circuit boards (PCBs), Rogers RO3006 laminates stand out as a technological marvel, offering unparalleled electrical and mechanical stability. These ceramic-filled PTFE composites have redefined the standards of high-frequency PCB design by maintaining a stable dielectric constant (Dk) across a broad range of temperatures, setting them apart from conventional PTFE glass materials.

 

Rogers RO3006: The Epitome of High-Frequency PCB Excellence

At the heart of RO3006's excellence are its exceptional features and benefits, setting a new benchmark for high-frequency laminates. With a dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C and an impressively low dissipation factor of 0.002 at the same frequency and temperature, RO3006 delivers superior performance in demanding high-frequency applications. Furthermore, its high thermal conductivity of 0.79 W/mK, thermal decomposition temperature (Td) exceeding 500°C, and minimal moisture absorption rate of 0.02% make RO3006 a robust and reliable choice for critical electronic environments.

 

Features and Benefits: A Closer Look at the Superiority of RO3006

One of the key advantages of RO3006 lies in its uniform mechanical properties, making it an ideal choice for multi-layer board designs with varying dielectric constants. The laminate's low in-plane expansion coefficient ensures reliable surface-mounted assemblies, excellent dimensional stability, and compatibility with epoxy glass multi-layer board hybrid designs. Additionally, the volume manufacturing process employed in producing RO3006 laminates results in cost-effective pricing, making it an economical yet high-performance solution for high-frequency PCB applications.

 

PCB Construction details:

Parameter Value
Board Dimensions 63.44mm x 48.5mm (2PCS)
Minimum Trace/Space 4/4 mils
Minimum Hole Size 0.3mm
Blind Vias No
Finished Board Thickness 0.3mm
Finished Cu Weight 1 oz (1.4 mils) outer layers
Via Plating Thickness 20 um
Surface Finish Immersion Gold
Top Silkscreen Black
Bottom Silkscreen No
Top Solder Mask No
Bottom Solder Mask No
Electrical Test 100% prior to shipment

 

Some Typical Applications:
A list of typical applications for RO3006 PCBs is provided, showcasing the diverse industries and technologies where these high-frequency laminates excel, including automotive radar, satellite communications, telecommunications, and wireless systems.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Bicheng Electronics Technology Co., Ltd
Location 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact Person Sally Mao

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