Rogers RO3203 High-Frequency PCBs 2-Layer 20mil Thickness Circuit Boards DK 3.02 with Immersion Tin apply for for wireless communications
Unveiling the Innovation of Rogers RO3203 High-Frequency PCBs: A Detailed Exploration of 2-Layer 20mil Thickness Circuit Boards
Introduction:
Step into the world of high-frequency circuit materials with the Rogers RO3203 PCB, an advanced ceramic-filled laminate that seamlessly combines exceptional electrical performance with unmatched mechanical stability. As an extension of the esteemed RO3000 Series, the RO3203 offers enhanced rigidity and reliability, with a dielectric constant of 3.02 and a dissipation factor of 0.0016, pushing the boundaries of frequency capabilities beyond 40 GHz.
Features and Benefits:
- Ceramic-filled PTFE composites ensure superior performance
- Dielectric constant of 3.02 and dissipation factor of 0.0016 for high-frequency applications
- Improved rigidity with woven glass reinforcement
- Uniform electrical and mechanical performance for complex structures
- Low dielectric loss suitable for applications exceeding 20 GHz
- Low in-plane expansion coefficient for compatibility with copper
- Excellent dimensional stability and cost-effective manufacturing
- Surface smoothness allows for fine line etching tolerances
PCB Construction Details:
- 2-layer rigid PCB stackup with copper layers and 20mil Rogers RO3203 substrate
- Board dimensions: 65.78mm x 37.48mm
- Minimum Trace/Space: 5/5 mils
- Finished board thickness: 0.6mm with immersion tin surface finish
- 100% Electrical test conducted prior to shipment
RO3203 Typical Value
| Property | RO3203 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.02±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Dissipation Factor,tanδ | 0.0016 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Conductivity | 0.47 (3.2) | W/mK | Float 100℃ | ASTM C518 | |
| Volume Resistivity | 107 | MΩ.cm | A | ASTM D257 | |
| Surface Resistivity | 107 | MΩ | A | ASTM D257 | |
| Dimensional Stability | 0.08 | X, Y | mm/m +E2/150 | after etch | IPC-TM-650 2.4.3.9 |
| Tensile Modulus | X Y | kpsi | RT | ASTM D638 | |
| Flexural Modulus | 400 300 | X Y | kpsi | A | ASTM D790 |
| Tensile Strength | 12.5 13 | X Y | kpsi | RT | ASTM D638 |
| Flexural Strength | 9 8 | X Y | kpsi | A | ASTM D790 |
| Moisure Absorption | <0.1 | % | D24/23 | IPC-TM-650 2.6.2.1 | |
| Coefficient of Thermal Expansion | 58 13 | Z X,Y | ppm/℃ | -50 ℃to 288℃ | ASTM D3386 |
| Td | 500 | ℃ | TGA | ASTM D3850 | |
| Density | 2.1 | gm/cm3 | 23℃ | ASTM D792 | |
| Copper Peel Stength | 10 (1.74) | lbs/in (N/mm) | After solder | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-Free Process Compatible | Yes |
PCB Statistics and Quality Standards:
- 10 components, 34 pads, and 29 vias for intricate design
- Compliant with IPC-Class-2 quality standards
- Accepts Gerber RS-274-X artwork and available worldwide
PCB Capability (RO3203)
| PCB Material: | Ceramic-filled Laminates Reinforced with Woven Fiberglass |
| Designation: | RO3203 |
| Dielectric constant: | 3.02±0.04 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Typical Applications:
- Automotive collision avoidance systems
- Wireless telecommunications infrastructure
- Microstrip patch antennas for wireless communications
- Direct broadcast satellites
- Power backplanes and LMDS for broadband applications
Conclusion:
The Rogers RO3203 PCB stands as a pinnacle of high-frequency circuit design, offering unparalleled performance, reliability, and versatility across a myriad of applications. With a focus on advanced technology and precision engineering, the RO3203 sets a new standard for high-frequency PCBs, catering to the evolving needs of industries worldwide.
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