Introducing the High-Performance F4BM220 PCB Laminates

Wangling's F4BM220 PCB laminates are designed to deliver exceptional electrical performance and reliability for a wide range of high-frequency applications. These advanced laminates are the result of our scientific formulation and precise manufacturing processes, making them a superior choice over similar foreign products.

Key Features of the F4BM220 Laminates:

• Dielectric constant (Dk) of 2.2±0.04 at 10GHz, providing excellent signal integrity
• Extremely low dissipation factor of 0.001 at 10GHz for minimal signal loss
• Exceptional dimensional stability with a low CTE of 25 ppm/°C (x-axis), 34 ppm/°C (y-axis), and 240 ppm/°C (z-axis)
• Robust thermal characteristics with a thermal coefficient of Dk at -142 ppm/°C (-55°C to 150°C)
• Moisture absorption of ≤0.08% for reliable performance in humid environments
• Flammability rating of UL-94 V0 for enhanced safety

These exceptional properties make the F4BM220 laminates an ideal choice for a wide range of high-frequency applications, including:

• Microwave, RF, and radar systems
• Phase shifters, power dividers, couplers, and combiners
• Feed networks for phase-sensitive antennas and phased array antennas
• Satellite communications equipment
• Base station antennas

The F4BM220 laminates are available in a 2-layer rigid PCB construction, with a board size of 130.5mm x 103mm (±0.15mm) and a finished thickness of 1.7mm. The PCBs feature 4/6 mil minimum trace/space, 0.3mm minimum hole size, and 1oz (1.4 mils) copper weight on the outer layers with a 20μm via plating thickness. The surface finish is Electroless Nickel Immersion Gold (ENIG), ensuring excellent solderability and corrosion resistance.

Whether you're working on cutting-edge microwave, RF, or radar systems, or any other high-frequency application, the F4BM220 laminates from Wangling offer the performance and reliability you need. Contact us today to learn more about how these advanced PCB materials can benefit your project.