Copper Coin Embedded PCB 6-Layer M6 and IS370HR Hybrid Resin-Filled Vias, And ENIG Finish

6-Layer Rigid PCB with M6 Material, High Tg FR-4, Resin-Filled Vias, and ENIG Finish

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Today I’m excited to introduce our 6-layer rigid PCB made with a combination of M6 high-speed material and High Tg FR-4. This PCB is designed for high-frequency applications, delivering exceptional thermal performance, low signal loss, and mechanical reliability. It features copper coin embedding, resin-filled and capped vias, and a high-quality ENIG surface finish, making it an excellent choice for industries like 5G communication, automotive electronics, and aerospace.

1. Overview of the 6-Layer Rigid PCB

This 6-layer PCB is engineered for high-speed and high-frequency designs, using M6 material for its core and IS370HR laminates for its prepreg layers. The PCB has a finished thickness of 1.0mm, with 1oz copper weight on the outer layers and resin-filled, capped vias to ensure excellent reliability.

The copper coin embedded in the center of the PCB enhances its thermal performance, making it suitable for applications requiring efficient heat dissipation. With green solder mask on both sides and white silkscreen, this PCB meets IPC-Class-2 quality standards and is rigorously tested for electrical reliability.

2. PCB Construction Details

3. PCB Stackup and Material Properties

The 6-layer stackup combines M6 material and IS370HR laminates for enhanced electrical and thermal performance:

Key Material Properties

M6 High-Speed Material

• Dielectric Constant (Dk): 3.4 at 1GHz, 3.34 at 13GHz
• Dissipation Factor (Df): 0.002 at 1GHz, 0.0037 at 13GHz
• High Tg: >185°C (DSC method), 210°C (DMA method)
• Thermal Decomposition Temperature (Td): 410°C
• RoHS and Halogen-Free Compliant

IS370HR Material

• Tg: 180°C (DSC)
• Thermal Decomposition Temperature (Td): 340°C
• Low X/Y CTE: 13/14ppm/°C for improved reliability
• UV Blocking: Ensures compatibility with Automated Optical Inspection (AOI)

4. Applications of the 6-Layer Rigid PCB

Millimeter-wave antennas and RF front-ends for Active Antenna Units (AAU).

Advanced Driver Assistance Systems (ADAS) and 77GHz millimeter-wave radar systems.

Routers, switches, and other high-speed networking equipment.

Radar systems, avionics, and satellite communication devices.

The combination of M6 material, copper coin embedding, and resin-filled vias ensures this PCB meets the demands of cutting-edge applications with superior thermal and electrical performance.

Why Choose Bicheng Technologies?

At Bicheng Technologies Limited, we specialize in delivering high-quality PCBs tailored to your specific requirements. Our 6-layer rigid PCB with M6 high-speed material and High Tg FR-4 is designed to meet the challenges of modern high-frequency designs.

1. Precision Manufacturing: All PCBs are tested to meet IPC-Class-2 standards.
2. Global Availability: We deliver our products worldwide, ensuring timely support for your projects.
3. Customer Focus: Our team works closely with you to provide customized solutions for your application needs.

If you have any technical questions or need assistance, feel free to contact me at sales30@bichengpcb.com. I look forward to helping you bring your ideas to life!