IsoClad 933 2-Layer PCB (62mil Thickness, Black Solder Mask, White Silkscreen) for High-Frequency Conformal and Radar Applications
IsoClad 933 2-Layer PCB (62mil Thickness, Black Solder Mask, White Silkscreen) for High-Frequency Conformal and Radar Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
Overview of IsoClad 933 2-Layer PCB
The IsoClad 933 2-layer PCB is a high-performance printed circuit board designed for advanced RF and microwave applications. Built with IsoClad 933 laminates, which combine nonwoven fiberglass with PTFE composites, this PCB provides excellent electrical performance, dimensional stability, and mechanical flexibility. Its low dielectric constant (Dk = 2.33 at 10 GHz), exceptionally low dissipation factor (Df = 0.0016 at 10 GHz), and isotropic mechanical properties make it an ideal choice for high-frequency designs.
The final board is fabricated to a thickness of 1.6 mm (62 mils), finished with Electroless Nickel Immersion Gold (ENIG) for superior reliability and solderability. With a black solder mask on the top side and white silkscreen overlay, this PCB combines visual clarity with advanced surface protection. Manufactured to IPC Class-2 quality standards, each board undergoes 100% electrical testing to guarantee performance and reliability.
PCB Construction Details
| Parameter | Specification |
| Base Material | IsoClad 933 (nonwoven fiberglass/PTFE composite) |
| Layer Count | 2 layers |
| Board Dimensions | 155.4 mm x 188 mm ± 0.15 mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.3 mm |
| Via Plating Thickness | 20 μm |
| Board Thickness | 1.6 mm (62 mils) |
| Finished Copper Weight | 1 oz (1.4 mils) on outer layers |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Solder Mask | Top Side: Black; Bottom Side: None |
| Silkscreen | Top Side: White; Bottom: None |
| Electrical Test | 100% prior to shipment |
| Quality Standard | IPC-Class-2 |
| Artwork Supplied | Gerber RS-274-X |
Advanced Stackup Design
The PCB is built with a two-layer rigid stackup:
- Top Copper Layer (35 μm)
- IsoClad 933 Core (1.575 mm / 62 mil)
- Bottom Copper Layer (35 μm)
Electrical & Mechanical Features
- Dielectric Constant (Dk @ 10GHz): 2.33
- Dissipation Factor (Df @ 10GHz): 0.0016
- Thermal Coefficient of Dk: -132 ppm/°C
- Dielectric Breakdown: >45 kV
- Peel Strength: 10 lbs/inch
- CTE Values: X = 31 ppm/°C, Y = 35 ppm/°C, Z = 203 ppm/°C
- Flammability: UL-94 V0
Statistics Summary
- Total Components: 66
- Total Pads: 192 (120 thru-hole, 72 top SMT)
- Vias: 231
- Nets: 2
Benefits
- Less rigid than woven fiberglass, making it suitable for bent or conformal use.
- Highly isotropic in X, Y, and Z axes, ensuring consistency across all design dimensions.
- Optimized for high-frequency microwave and radar circuits, delivering reliable long-term performance.
Applications
- Conformal and wrap-around antennas
- Stripline and microstrip RF circuits
- Missile guidance electronics
- Radar and advanced electronic warfare systems
In summary, the IsoClad 933 2-layer PCB (62 mil, black solder mask, white silkscreen) offers unmatched performance for advanced RF, microwave, and defense-related electronic systems. Its unique balance of mechanical flexibility, thermal stability, and outstanding high-frequency properties ensures optimized performance in demanding aerospace and defense applications.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
