TMM6 PCB 2-Layer 0.035mm copper weight and 15mil laminate with Immersion Silver Global Positioning Systems Antennas
TMM6 PCB: 2-Layer, 15mil Core, 0.5mm Thickness with Immersion Silver Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
Overview of TMM6 2-Layer PCB
The TMM6 PCB is a high-performance 2-layer rigid PCB designed for RF, microwave, and satellite communication applications. Built with Rogers TMM6 laminates, this PCB features a 15mil (0.381mm) core and a finished thickness of 0.5mm, offering low dielectric loss, high plated-through-hole reliability, and excellent mechanical stability.
With a dielectric constant (Dk) of 6.0 ± 0.08, the TMM6 PCB is ideal for precision microstrip and stripline circuits. Its Immersion Silver surface finish ensures optimal solderability, low contact resistance, and enhanced conductivity.
PCB Construction Details
| Parameter | Specification |
| Base Material | Rogers TMM6 |
| Layer Count | 2 layers |
| Board Dimensions | 40mm x 70mm |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.2mm |
| Blind Vias | None |
| Finished Thickness | 0.5mm |
| Copper Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Silver |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Electrical Testing | 100% tested before shipment |
PCB Stackup
| Layer | Material | Thickness |
| Copper Layer 1 | Copper (1oz) | 35μm |
| Dielectric Layer | Rogers TMM6 Core | 0.381mm (15mil) |
| Copper Layer 2 | Copper (1oz) | 35μm |
Introduction to TMM6 Material
The Rogers TMM6 laminates are ceramic thermoset polymer composites, specifically designed for microwave and RF circuits. These laminates combine the electrical performance of ceramics with the mechanical stability of traditional PTFE materials, without requiring specialized production techniques.
Key Features of TMM6
- Dielectric Constant (Dk): 6.0 ± 0.08 at 10GHz.
- Dissipation Factor: Low at 0.0023 at 10GHz.
- Thermal Conductivity: 0.72 W/m·K for effective heat dissipation.
- Thermal Coefficient of Dk: -11 ppm/°K for stable performance over temperature changes.
- Coefficient of Thermal Expansion (CTE): X-axis: 18 ppm/°K. Y-axis: 18 ppm/°K. Z-axis: 26 ppm/°K.
- Decomposition Temperature (Td): 425°C (TGA).
- Moisture Absorption: Low at <0.02%.
Benefits of TMM6
- Resistant to Process Chemicals: Reduces damage during manufacturing.
- Mechanical Stability: Properties resist creep and cold flow under stress.
- Wire-Bonding Compatibility: Reliable for advanced assembly processes.
- Standard Manufacturing Processes: No need for specialized handling or production techniques.
Applications
- RF and Microwave Circuitry
- Power Amplifiers and Combiners
- Filters and Couplers
- Satellite Communication Systems
- Global Positioning Systems (GPS) Antennas
- Patch Antennas
- Dielectric Polarizers and Lenses
- Chip Testers
Conclusion
The TMM6 2-layer PCB is a premium solution for RF and microwave circuit designs, offering low electrical loss, mechanical stability, and thermal reliability. With its 15mil TMM6 core, Immersion Silver finish, and high-frequency performance, this PCB is ideal for applications like satellite communication systems, GPS antennas, and RF power amplifiers.
Compliant with IPC-Class-2 standards and available worldwide, the TMM6 PCB is the perfect choice for engineers seeking cost-effective, high-performance materials for advanced RF and microwave applications.
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