Rogers laminates fabricate RO3006 2-layer RF PCB with Pure gold wire bonding for Microwave PCB design
RO3006 2-Layer PCB: Compact High-Frequency Solution
The RO3006 2-layer PCB is a high-quality, compact solution designed for RF and microwave applications. Made with Rogers RO3006 material, this PCB ensures excellent signal integrity, low dielectric loss, and reliable performance, even in challenging environments. Its pure gold finish further enhances its suitability for wire bonding, making it ideal for advanced electronics.
Key Construction Details
| Parameter | Specification |
| Base Material | Rogers RO3006 |
| Layer Count | 2 layers |
| Board Dimensions | 20mm x 25mm |
| Minimum Trace/Space | 5/9 mils |
| Minimum Hole Size | 0.2mm |
| Finished Thickness | 0.2mm |
| Copper Weight | 1oz (35μm) on both layers |
| Surface Finish | Pure Gold (30μ") for wire bonding |
Features of RO3006 Material
- Dielectric Constant (Dk): 6.15 ± 0.15 at 10GHz
- Dissipation Factor (Df): 0.002 at 10GHz
- Thermal Stability: Td > 500°C
- Moisture Absorption: 0.02%
- Low CTE: X/Y: 17 ppm/°C, Z: 24 ppm/°C
Applications
- Automotive Radar Systems
- GPS Antennas
- Wireless Communication Antennas
- Satellite Systems
- Microwave Transmission Devices
Why Choose RO3006 PCB?
Pure Gold Finish: Reliable wire bonding and excellent conductivity.
Compact Design: Perfect for space-constrained applications.
High-Frequency Performance: Minimal signal loss up to 77GHz.
Thermal and Moisture Resistance: Ideal for harsh environments.
The RO3006 2-layer PCB is a trusted choice for high-frequency applications requiring precision, reliability, and performance. Contact us today to learn more!
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